IPC International, Inc. Chip Mounting Technology WP-003

Description
DESCRIPTION Status of the technology discussion on the various methodologies for mounting and interconnecting active devices to a variety of substrate materials is summarized in this document. Reviews mounting techniques of tape automated bonding (TAB), chip on board (COB) and flip chip. Examinations of the most commonly used substrate options of laminate, ceramic and silicon are also reviewed. Editor: John Biancini, Intercon Corporation. 33 pages. Released by the Surface Mount Council, August 1993.
  • Chip Mounting Technology - WP-003 - IPC International, Inc.
    IPC International, Inc.
Description
DESCRIPTION Status of the technology discussion on the various methodologies for mounting and interconnecting active devices to a variety of substrate materials is summarized in this document. Reviews mounting techniques of tape automated bonding (TAB), chip on board (COB) and flip chip. Examinations of the most commonly used substrate options of laminate, ceramic and silicon are also reviewed. Editor: John Biancini, Intercon Corporation. 33 pages. Released by the Surface Mount Council, August 1993.

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Chip Mounting Technology - WP-003 - IPC International, Inc.
IPC International, Inc.
Bannockburn, IL, United States
Chip Mounting Technology
WP-003
Chip Mounting Technology WP-003
DESCRIPTION Status of the technology discussion on the various methodologies for mounting and interconnecting active devices to a variety of substrate materials is summarized in this document. Reviews mounting techniques of tape automated bonding (TAB), chip on board (COB) and flip chip. Examinations of the most commonly used substrate options of laminate, ceramic and silicon are also reviewed. Editor: John Biancini, Intercon Corporation. 33 pages. Released by the Surface Mount Council, August 1993.

DESCRIPTION
Status of the technology discussion on the various methodologies for mounting and interconnecting active devices to a variety of substrate materials is summarized in this document. Reviews mounting techniques of tape automated bonding (TAB), chip on board (COB) and flip chip. Examinations of the most commonly used substrate options of laminate, ceramic and silicon are also reviewed. Editor: John Biancini, Intercon Corporation. 33 pages. Released by the Surface Mount Council, August 1993.

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Technical Specifications

  IPC International, Inc.
Product Category Standards and Technical Documents
Product Number WP-003
Product Name Chip Mounting Technology
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