IPC International, Inc. Y-12 Lead-Free Solder Technologies TW0412-MAGMORPH

Description
DESCRIPTION This paper was presented at the IPC Tin Whiskers Conference, April 18, 2012, by Russell Hallman, Senior Engineer at Y-12 National Security Complex. The author examines the properties of non-magnetic material in magnetic fields as applied to solders and plating and possible effects on tin whisker growth. He shows that control of microstructure can control performance of surface wetting and crystal growth by distribution of chemistry in the mechanical joint. He then describes some areas for future study and expected benefits. This presentation includes the synchronized slides and audio from the original presentation. 31 minutes. Released 2012.
  • Y-12 Lead-Free Solder Technologies - TW0412-MAGMORPH - IPC International, Inc.
    IPC International, Inc.
Description
DESCRIPTION This paper was presented at the IPC Tin Whiskers Conference, April 18, 2012, by Russell Hallman, Senior Engineer at Y-12 National Security Complex. The author examines the properties of non-magnetic material in magnetic fields as applied to solders and plating and possible effects on tin whisker growth. He shows that control of microstructure can control performance of surface wetting and crystal growth by distribution of chemistry in the mechanical joint. He then describes some areas for future study and expected benefits. This presentation includes the synchronized slides and audio from the original presentation. 31 minutes. Released 2012.

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Y-12 Lead-Free Solder Technologies - TW0412-MAGMORPH - IPC International, Inc.
IPC International, Inc.
Bannockburn, IL, United States
Y-12 Lead-Free Solder Technologies
TW0412-MAGMORPH
Y-12 Lead-Free Solder Technologies TW0412-MAGMORPH
DESCRIPTION This paper was presented at the IPC Tin Whiskers Conference, April 18, 2012, by Russell Hallman, Senior Engineer at Y-12 National Security Complex. The author examines the properties of non-magnetic material in magnetic fields as applied to solders and plating and possible effects on tin whisker growth. He shows that control of microstructure can control performance of surface wetting and crystal growth by distribution of chemistry in the mechanical joint. He then describes some areas for future study and expected benefits. This presentation includes the synchronized slides and audio from the original presentation. 31 minutes. Released 2012.

DESCRIPTION

This paper was presented at the IPC Tin Whiskers Conference, April 18, 2012, by Russell Hallman, Senior Engineer at Y-12 National Security Complex. The author examines the properties of non-magnetic material in magnetic fields as applied to solders and plating and possible effects on tin whisker growth. He shows that control of microstructure can control performance of surface wetting and crystal growth by distribution of chemistry in the mechanical joint. He then describes some areas for future study and expected benefits.

This presentation includes the synchronized slides and audio from the original presentation. 31 minutes. Released 2012.

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Technical Specifications

  IPC International, Inc.
Product Category Standards and Technical Documents
Product Number TW0412-MAGMORPH
Product Name Y-12 Lead-Free Solder Technologies
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