DESCRIPTION
Approximately 200,000 plated through-holes, covering primarily electroplated but also electroless technology, were exposed to several different thermal cycles. A number of PTH diameters, board constructions and plating thicknesses were evaluated. 80 pages. Released September 1988.
Included in the IPC-C-105 and the IPC-C-1000 Collections
| IPC International, Inc. | |
|---|---|
| Product Category | Standards and Technical Documents |
| Product Number | TR-579 |
| Product Name | Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PWBs |