IPC International, Inc. PCB Technology Trends 2011 TECHTR-11E

Description
DESCRIPTION This global study of technology trends in the PCB industry is based on an extensive survey in which 41 leading PCB companies from all regions of the world participated. It covers issues in PCB technology today and expectations for developments through 2014. Topics include trends in high-density interconnect (HDI) and microvias, miniaturization in PCB production, solder mask, final finishes, metals, substrate materials, laminates, embedded technology, printed electronics, optics and manufacturing equipment. Sales growth drivers, the impact on sourcing, technical challenges and unmet technology needs are also explored. 53 pages of content. Published April 2012
  • PCB Technology Trends 2011 - TECHTR-11E - IPC International, Inc.
    IPC International, Inc.
Description
DESCRIPTION This global study of technology trends in the PCB industry is based on an extensive survey in which 41 leading PCB companies from all regions of the world participated. It covers issues in PCB technology today and expectations for developments through 2014. Topics include trends in high-density interconnect (HDI) and microvias, miniaturization in PCB production, solder mask, final finishes, metals, substrate materials, laminates, embedded technology, printed electronics, optics and manufacturing equipment. Sales growth drivers, the impact on sourcing, technical challenges and unmet technology needs are also explored. 53 pages of content. Published April 2012

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PCB Technology Trends 2011 - TECHTR-11E - IPC International, Inc.
IPC International, Inc.
Bannockburn, IL, United States
PCB Technology Trends 2011
TECHTR-11E
PCB Technology Trends 2011 TECHTR-11E
DESCRIPTION This global study of technology trends in the PCB industry is based on an extensive survey in which 41 leading PCB companies from all regions of the world participated. It covers issues in PCB technology today and expectations for developments through 2014. Topics include trends in high-density interconnect (HDI) and microvias, miniaturization in PCB production, solder mask, final finishes, metals, substrate materials, laminates, embedded technology, printed electronics, optics and manufacturing equipment. Sales growth drivers, the impact on sourcing, technical challenges and unmet technology needs are also explored. 53 pages of content. Published April 2012

DESCRIPTION

This global study of technology trends in the PCB industry is based on an extensive survey in which 41 leading PCB companies from all regions of the world participated. It covers issues in PCB technology today and expectations for developments through 2014. Topics include trends in high-density interconnect (HDI) and microvias, miniaturization in PCB production, solder mask, final finishes, metals, substrate materials, laminates, embedded technology, printed electronics, optics and manufacturing equipment. Sales growth drivers, the impact on sourcing, technical challenges and unmet technology needs are also explored. 53 pages of content. Published April 2012

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  IPC International, Inc.
Product Category Standards and Technical Documents
Product Number TECHTR-11E
Product Name PCB Technology Trends 2011
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