DESCRIPTION
Discusses chip types, board selection, design issues and thermal transfer methods for Chip on Board (COB) applications. Details wire bonding, TAB and flip chip designs and provides information on mounting materials, including adhesives, wires and various mechanical bonding techniques. 37 pages. Released November 1990.
| IPC International, Inc. | |
|---|---|
| Product Category | Standards and Technical Documents |
| Product Number | SM-784 |
| Product Name | Guidelines for Chip-on-Board Technology Implementation |
