IPC International, Inc. Controlling Moisture Content in Boards: Best Practices PDWEB10-MOISTURE

DESCRIPTION This webinar was given on July 28, 2010 by Bhanu Sood, CALCE. Reliability of printed circuit board (PCB) materials is strongly influenced by the presence of moisture. Moisture can be initially present in the epoxy glass prepreg, absorbed during the wet processes in PCB manufacturing or diffuse into the PCB during storage. Moisture can reside in the resin, resin/glass interfaces and micro-cracks or voids due to defects. Higher reflow temperatures associated with lead-free processing increase the vapor pressure, which can lead to higher amounts of moisture uptake as compared to eutectic tin lead reflow processes. The presence of moisture can lead to the creation of low impedance paths due to metal migration, interfacial degradation resulting in conductive filament formation and changes in dimensional stability. Studies have shown that moisture also reduces the glass-transition temperature and increases the dielectric constant, leading to a reduction in circuit switching speeds and an increase in propagation delay times. 1 hour 15 minutes. Released 2010. What you will learn • Governing models and dependant variables of the moisture diffusion process • Effects of moisture on various susceptible components of a PCB (epoxy matrix, interfaces, vias, traces, solder masks, overcoats, etc.) and associated failure modes and mechanisms • PCB material handling and storage guidelines This downloadable webinar includes synchronized audio and slides. This format is a single-user license and can only be used on a one-user computer. A site and global license is also available.