DESCRIPTION
Provides information on multichip module technology, including parametric data, design and manufacturing information and a proposed categorization of various approaches to multichip interconnect substrate technologies based on dielectric family. 120 pages. Released August 1992.
Provides information on multichip module technology, including parametric data, design and manufacturing information and a proposed categorization of various approaches to multichip interconnect substrate technologies based on dielectric family. 120 pages
| IPC International, Inc. | |
|---|---|
| Product Category | Standards and Technical Documents |
| Product Number | MC-790 |
| Product Name | Guidelines for Multichip Module Technology Utilization |