IPC International, Inc. Guidelines for Multichip Module Technology Utilization MC-790

Description
DESCRIPTION Provides information on multichip module technology, including parametric data, design and manufacturing information and a proposed categorization of various approaches to multichip interconnect substrate technologies based on dielectric family. 120 pages. Released August 1992.
Description
DESCRIPTION Provides information on multichip module technology, including parametric data, design and manufacturing information and a proposed categorization of various approaches to multichip interconnect substrate technologies based on dielectric family. 120 pages. Released August 1992.

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Guidelines for Multichip Module Technology Utilization - MC-790 - IPC International, Inc.
Bannockburn, IL, United States
Guidelines for Multichip Module Technology Utilization
MC-790
Guidelines for Multichip Module Technology Utilization MC-790
DESCRIPTION Provides information on multichip module technology, including parametric data, design and manufacturing information and a proposed categorization of various approaches to multichip interconnect substrate technologies based on dielectric family. 120 pages. Released August 1992.

DESCRIPTION
Provides information on multichip module technology, including parametric data, design and manufacturing information and a proposed categorization of various approaches to multichip interconnect substrate technologies based on dielectric family. 120 pages. Released August 1992.

Supplier's Site
Guidelines for Multichip Module Technology Utilization - MC-790 - IPC International, Inc.
Bannockburn, IL, United States
Guidelines for Multichip Module Technology Utilization
MC-790
Guidelines for Multichip Module Technology Utilization MC-790
Provides information on multichip module technology, including parametric data, design and manufacturing information and a proposed categorization of various approaches to multichip interconnect substrate technologies based on dielectric family. 120 pages

Provides information on multichip module technology, including parametric data, design and manufacturing information and a proposed categorization of various approaches to multichip interconnect substrate technologies based on dielectric family. 120 pages

Supplier's Site

Technical Specifications

  IPC International, Inc.
Product Category Standards and Technical Documents
Product Number MC-790
Product Name Guidelines for Multichip Module Technology Utilization
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