IPC International, Inc. Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components J-STD-035

Description
DESCRIPTION This test method defines the procedures for performing acoustic microscopy on non-hermetic encapsulated electronic components. It provides users with an acoustic microscopy process flow for detecting defects non-destructively in plastic packages while achieving reproducibility. Developed by IPC and JEDEC. 16 pages. Released April 1999.
  • Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components - J-STD-035 - IPC International, Inc.
    IPC International, Inc.
  • Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components - J-STD-035 - IPC International, Inc.
    IPC International, Inc.
Description
DESCRIPTION This test method defines the procedures for performing acoustic microscopy on non-hermetic encapsulated electronic components. It provides users with an acoustic microscopy process flow for detecting defects non-destructively in plastic packages while achieving reproducibility. Developed by IPC and JEDEC. 16 pages. Released April 1999.

Suppliers

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Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components - J-STD-035 - IPC International, Inc.
IPC International, Inc.
Bannockburn, IL, United States
Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components
J-STD-035
Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components J-STD-035
DESCRIPTION This test method defines the procedures for performing acoustic microscopy on non-hermetic encapsulated electronic components. It provides users with an acoustic microscopy process flow for detecting defects non-destructively in plastic packages while achieving reproducibility. Developed by IPC and JEDEC. 16 pages. Released April 1999.

DESCRIPTION
This test method defines the procedures for performing acoustic microscopy on non-hermetic encapsulated electronic components. It provides users with an acoustic microscopy process flow for detecting defects non-destructively in plastic packages while achieving reproducibility. Developed by IPC and JEDEC. 16 pages. Released April 1999.

Supplier's Site
Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components - J-STD-035 - IPC International, Inc.
IPC International, Inc.
Bannockburn, IL, United States
Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components
J-STD-035
Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components J-STD-035
This test method defines the procedures for performing acoustic microscopy on non-hermetic encapsulated electronic components. It provides users with an acoustic microscopy process flow for detecting defects non-destructively in plastic packages while achieving reproducibility.

This test method defines the procedures for performing acoustic microscopy on non-hermetic encapsulated electronic components. It provides users with an acoustic microscopy process flow for detecting defects non-destructively in plastic packages while achieving reproducibility.

Supplier's Site

Technical Specifications

  IPC International, Inc.
Product Category Standards and Technical Documents
Product Number J-STD-035
Product Name Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components
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