IPC International, Inc. Performance Standard for Ball Grid Array Balls J-STD-032

Description
DESCRIPTION This standard, developed jointly by IPC and the Electronic Industries Association (EIA) establishes the construction detail requirements for balls and other terminal structures on Ball Grid Array (BGA) packages. It also establishes a set of designations and expectations for product performance. A large variety of terminal structures are recognized for a wide range of applications ranging from highest reliability computer, space and military applications to disposable commodity applications. 10 pages. Released June 2002.
  • Performance Standard for Ball Grid Array Balls - J-STD-032 - IPC International, Inc.
    IPC International, Inc.
Description
DESCRIPTION This standard, developed jointly by IPC and the Electronic Industries Association (EIA) establishes the construction detail requirements for balls and other terminal structures on Ball Grid Array (BGA) packages. It also establishes a set of designations and expectations for product performance. A large variety of terminal structures are recognized for a wide range of applications ranging from highest reliability computer, space and military applications to disposable commodity applications. 10 pages. Released June 2002.

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Performance Standard for Ball Grid Array Balls - J-STD-032 - IPC International, Inc.
IPC International, Inc.
Bannockburn, IL, United States
Performance Standard for Ball Grid Array Balls
J-STD-032
Performance Standard for Ball Grid Array Balls J-STD-032
DESCRIPTION This standard, developed jointly by IPC and the Electronic Industries Association (EIA) establishes the construction detail requirements for balls and other terminal structures on Ball Grid Array (BGA) packages. It also establishes a set of designations and expectations for product performance. A large variety of terminal structures are recognized for a wide range of applications ranging from highest reliability computer, space and military applications to disposable commodity applications. 10 pages. Released June 2002.

DESCRIPTION
This standard, developed jointly by IPC and the Electronic Industries Association (EIA) establishes the construction detail requirements for balls and other terminal structures on Ball Grid Array (BGA) packages. It also establishes a set of designations and expectations for product performance. A large variety of terminal structures are recognized for a wide range of applications ranging from highest reliability computer, space and military applications to disposable commodity applications. 10 pages. Released June 2002.

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Technical Specifications

  IPC International, Inc.
Product Category Standards and Technical Documents
Product Number J-STD-032
Product Name Performance Standard for Ball Grid Array Balls
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