This document provides users of underfill material with guidance in selecting and evaluating underfill material. Underfill material is used to increase reliability of electronic devices by two methods: alleviate CTE mismatch (between the electronic package and the assembly substrate) and/or increase mechanical strength.
| IPC International, Inc. | |
|---|---|
| Product Category | Standards and Technical Documents |
| Product Number | J-STD-030 |
| Product Name | Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micropackages |
