IPC International, Inc. Mechanical Outline Standard for Flip Chip and Chip Size Configurations J-STD-027

Description
DESCRIPTION This standard establishes mechanical outline requirements for devices supplied in flip chip or Chip Size Package (CSP) formats, including die surface, die terminals, and interconnection balls/bumps/lands to the next level. 13 Pages. Released February 2003.
  • Mechanical Outline Standard for Flip Chip and Chip Size Configurations - J-STD-027 - IPC International, Inc.
    IPC International, Inc.
Description
DESCRIPTION This standard establishes mechanical outline requirements for devices supplied in flip chip or Chip Size Package (CSP) formats, including die surface, die terminals, and interconnection balls/bumps/lands to the next level. 13 Pages. Released February 2003.

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Mechanical Outline Standard for Flip Chip and Chip Size Configurations - J-STD-027 - IPC International, Inc.
IPC International, Inc.
Bannockburn, IL, United States
Mechanical Outline Standard for Flip Chip and Chip Size Configurations
J-STD-027
Mechanical Outline Standard for Flip Chip and Chip Size Configurations J-STD-027
DESCRIPTION This standard establishes mechanical outline requirements for devices supplied in flip chip or Chip Size Package (CSP) formats, including die surface, die terminals, and interconnection balls/bumps/lands to the next level. 13 Pages. Released February 2003.

DESCRIPTION
This standard establishes mechanical outline requirements for devices supplied in flip chip or Chip Size Package (CSP) formats, including die surface, die terminals, and interconnection balls/bumps/lands to the next level. 13 Pages. Released February 2003.

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Technical Specifications

  IPC International, Inc.
Product Category Standards and Technical Documents
Product Number J-STD-027
Product Name Mechanical Outline Standard for Flip Chip and Chip Size Configurations
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