IPC International, Inc. Implementation of Ball Grid Array & Other High Density Technology J-STD-013

Description
DESCRIPTION This document establishes the requirements and interactions necessary for printed board assembly processes for interconnecting high performance/high pin count IC packages. Includes information on design principles, material selection, board fabrication, assembly technology, testing strategy and reliability expectations based on end-use environments. Developed by IPC, EIA, MCNC and Sematech. 96 Pages. Released July 1996.
  • Implementation of Ball Grid Array & Other High Density Technology - J-STD-013 - IPC International, Inc.
    IPC International, Inc.
  • Implementation of Ball Grid Array & Other High Density Technology - J-STD-013 - IPC International, Inc.
    IPC International, Inc.
Description
DESCRIPTION This document establishes the requirements and interactions necessary for printed board assembly processes for interconnecting high performance/high pin count IC packages. Includes information on design principles, material selection, board fabrication, assembly technology, testing strategy and reliability expectations based on end-use environments. Developed by IPC, EIA, MCNC and Sematech. 96 Pages. Released July 1996.

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Implementation of Ball Grid Array & Other High Density Technology - J-STD-013 - IPC International, Inc.
IPC International, Inc.
Bannockburn, IL, United States
Implementation of Ball Grid Array & Other High Density Technology
J-STD-013
Implementation of Ball Grid Array & Other High Density Technology J-STD-013
DESCRIPTION This document establishes the requirements and interactions necessary for printed board assembly processes for interconnecting high performance/high pin count IC packages. Includes information on design principles, material selection, board fabrication, assembly technology, testing strategy and reliability expectations based on end-use environments. Developed by IPC, EIA, MCNC and Sematech. 96 Pages. Released July 1996.


DESCRIPTION
This document establishes the requirements and interactions necessary for printed board assembly processes for interconnecting high performance/high pin count IC packages. Includes information on design principles, material selection, board fabrication, assembly technology, testing strategy and reliability expectations based on end-use environments. Developed by IPC, EIA, MCNC and Sematech. 96 Pages. Released July 1996.

Supplier's Site
Implementation of Ball Grid Array & Other High Density Technology - J-STD-013 - IPC International, Inc.
IPC International, Inc.
Bannockburn, IL, United States
Implementation of Ball Grid Array & Other High Density Technology
J-STD-013
Implementation of Ball Grid Array & Other High Density Technology J-STD-013
This document establishes the requirements and interactions necessary for printed board assembly processes for interconnecting high performance/high pin count IC packages. Includes information on design principles, material selection, board fabrication, assembly technology, testing strategy and reliability expectations based on end-use environments.

This document establishes the requirements and interactions necessary for printed board assembly processes for interconnecting high performance/high pin count IC packages. Includes information on design principles, material selection, board fabrication, assembly technology, testing strategy and reliability expectations based on end-use environments.

Supplier's Site

Technical Specifications

  IPC International, Inc.
Product Category Standards and Technical Documents
Product Number J-STD-013
Product Name Implementation of Ball Grid Array & Other High Density Technology
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