DESCRIPTION This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon and powder solders for electronic soldering applications; and for ‘‘special’’ electronic grade solders. This is a quality control standard and is not intended to relate directly to the material’s performance in the manufacturing process. Solders for applications other than electronics should be procured using ASTM B-32.
This standard is one of a set of three joint industry standards that prescribe the requirements and test methods for soldering materials to be used in the electronics industry. The other two standards in this set are IPC/EIA J-STD-004, Requirements for Soldering Fluxes, and IPC/EIA J-STD-005, Requirements for Soldering Pastes. 29 pages. Released October 2009.
Amendments 1 and 2 included in this J-STD-006B modify the following:
Add reference to IPC/JEDEC J-STD-609, Lead-Free and Leaded Marking,Symbols and Labels
Clarify the meaning of those alloys that are designated as lead-free
Provide guidance to suppliers how to designate and mark lead-free alloys
Correct the required maximum levels of lead (Pb) and antimony (Sb) allowed as impurities in section 3.3 Alloy Impurities
Transfer all information references on solder powder particle size distribution and solder paste products to IPC J-STD-005, Requirements for Solder Pastes
Remove Table 3-1 “Particle Size Distributions of Standard Solder Powders”
Change the information contained in Table A-1 “Composition and Temperature Characteristics of Lead-free Solder 8. Alloys” (contained in Appendix A “Solder Alloys”) and
Establish a consistent maximum contaminant level requirement within Appendix B-1 for the elements of silver (Ag), lead (Pb) and antimony (Sb)
DESCRIPTION
This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon and powder solders for electronic soldering applications; and for ‘‘special’’ electronic grade solders. This is a quality control standard and is not intended to relate directly to the material’s performance in the manufacturing process. Solders for applications other than electronics should be procured using ASTM B-32.
This standard is one of a set of three joint industry standards that prescribe the requirements and test methods for soldering materials to be used in the electronics industry. The other two standards in this set are IPC/EIA J-STD-004, Requirements for Soldering Fluxes, and IPC/EIA J-STD-005, Requirements for Soldering Pastes. 29 pages. Released October 2009.
Amendments 1 and 2 included in this J-STD-006B modify the following:
- Add reference to IPC/JEDEC J-STD-609, Lead-Free and Leaded Marking,Symbols and Labels
- Clarify the meaning of those alloys that are designated as lead-free
- Provide guidance to suppliers how to designate and mark lead-free alloys
- Correct the required maximum levels of lead (Pb) and antimony (Sb) allowed as impurities in section 3.3 Alloy Impurities
- Transfer all information references on solder powder particle size distribution and solder paste products to IPC J-STD-005, Requirements for Solder Pastes
- Remove Table 3-1 “Particle Size Distributions of Standard Solder Powders”
- Change the information contained in Table A-1 “Composition and Temperature Characteristics of Lead-free Solder 8. Alloys” (contained in Appendix A “Solder Alloys”) and
- Establish a consistent maximum contaminant level requirement within Appendix B-1 for the elements of silver (Ag), lead (Pb) and antimony (Sb)
