IPC International, Inc. Requirements for Soldering Pastes J-STD-005A

Description
DESCRIPTION This standard lists requirements for qualification and characterization of solder paste. It references test methods and criteria for metal content, viscosity, slump, solder ball, tack and wetting of solder pastes. Additional support is provided in IPC-HDBK-005, Guide to Solder Paste Assessment (not included with purchase of this standard). Supersedes J-STD-005. 10 pages. Released February 2012.
  • Requirements for Soldering Pastes - J-STD-005A - IPC International, Inc.
    IPC International, Inc.
  • Requirements for Soldering Pastes - J-STD-005A - IPC International, Inc.
    IPC International, Inc.
Description
DESCRIPTION This standard lists requirements for qualification and characterization of solder paste. It references test methods and criteria for metal content, viscosity, slump, solder ball, tack and wetting of solder pastes. Additional support is provided in IPC-HDBK-005, Guide to Solder Paste Assessment (not included with purchase of this standard). Supersedes J-STD-005. 10 pages. Released February 2012.

Suppliers

Company
Product
Description
Supplier Links
Requirements for Soldering Pastes - J-STD-005A - IPC International, Inc.
IPC International, Inc.
Bannockburn, IL, United States
Requirements for Soldering Pastes
J-STD-005A
Requirements for Soldering Pastes J-STD-005A
DESCRIPTION This standard lists requirements for qualification and characterization of solder paste. It references test methods and criteria for metal content, viscosity, slump, solder ball, tack and wetting of solder pastes. Additional support is provided in IPC-HDBK-005, Guide to Solder Paste Assessment (not included with purchase of this standard). Supersedes J-STD-005. 10 pages. Released February 2012.


DESCRIPTION

This standard lists requirements for qualification and characterization of solder paste. It references test methods and criteria for metal content, viscosity, slump, solder ball, tack and wetting of solder pastes. Additional support is provided in IPC-HDBK-005, Guide to Solder Paste Assessment (not included with purchase of this standard). Supersedes J-STD-005. 10 pages. Released February 2012.

Supplier's Site
Requirements for Soldering Pastes - J-STD-005A - IPC International, Inc.
IPC International, Inc.
Bannockburn, IL, United States
Requirements for Soldering Pastes
J-STD-005A
Requirements for Soldering Pastes J-STD-005A
This standard lists requirements for qualification and characterization of solder paste. It references test methods and criteria for metal content, viscosity, slump, solder ball, tack and wetting of solder pastes.

This standard lists requirements for qualification and characterization of solder paste. It references test methods and criteria for metal content, viscosity, slump, solder ball, tack and wetting of solder pastes.

Supplier's Site

Technical Specifications

  IPC International, Inc.
Product Category Standards and Technical Documents
Product Number J-STD-005A
Product Name Requirements for Soldering Pastes
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