This standard prescribes test methods, defect definitions, acceptance criteria and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs and tabs. This standard addresses both visual acceptance and force measurement solderability criteria for both tin-lead as well as lead-free solder processes. This standard also includes a test method for the Resistance to Dissolution/Dewettin
| IPC International, Inc. | |
|---|---|
| Product Category | Standards and Technical Documents |
| Product Number | J-STD-002C |
| Product Name | Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment 1 |