IPC International, Inc. Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment 1 J-STD-002C

Description
This standard prescribes test methods, defect definitions, acceptance criteria and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs and tabs. This standard addresses both visual acceptance and force measurement solderability criteria for both tin-lead as well as lead-free solder processes. This standard also includes a test method for the Resistance to Dissolution/Dewettin g of Metallization to verify that metallized terminations will remain intact throughout the assembly soldering processes.
Description
This standard prescribes test methods, defect definitions, acceptance criteria and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs and tabs. This standard addresses both visual acceptance and force measurement solderability criteria for both tin-lead as well as lead-free solder processes. This standard also includes a test method for the Resistance to Dissolution/Dewettin g of Metallization to verify that metallized terminations will remain intact throughout the assembly soldering processes.

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Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment 1 - J-STD-002C - IPC International, Inc.
Bannockburn, IL, United States
Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment 1
J-STD-002C
Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment 1 J-STD-002C
This standard prescribes test methods, defect definitions, acceptance criteria and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs and tabs. This standard addresses both visual acceptance and force measurement solderability criteria for both tin-lead as well as lead-free solder processes. This standard also includes a test method for the Resistance to Dissolution/Dewettin g of Metallization to verify that metallized terminations will remain intact throughout the assembly soldering processes.

This standard prescribes test methods, defect definitions, acceptance criteria and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs and tabs. This standard addresses both visual acceptance and force measurement solderability criteria for both tin-lead as well as lead-free solder processes. This standard also includes a test method for the Resistance to Dissolution/Dewetting of Metallization to verify that metallized terminations will remain intact throughout the assembly soldering processes.

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Technical Specifications

  IPC International, Inc.
Product Category Standards and Technical Documents
Product Number J-STD-002C
Product Name Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment 1
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