IPC International, Inc. Specification for Multilayer Hybrid Circuits HM-860

Description
DESCRIPTION Covers the qualification and performance requirements of multilayer circuits used in hybrid packaging. These circuits consist of three or more layers of conductor patterns separated from each other by insulating materials and interconnected by a continuous metallic interlayer connection. The substrate may include passive elements. 66 pages. Released January 1987.
  • Specification for Multilayer Hybrid Circuits - HM-860 - IPC International, Inc.
    IPC International, Inc.
Description
DESCRIPTION Covers the qualification and performance requirements of multilayer circuits used in hybrid packaging. These circuits consist of three or more layers of conductor patterns separated from each other by insulating materials and interconnected by a continuous metallic interlayer connection. The substrate may include passive elements. 66 pages. Released January 1987.

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Specification for Multilayer Hybrid Circuits - HM-860 - IPC International, Inc.
IPC International, Inc.
Bannockburn, IL, United States
Specification for Multilayer Hybrid Circuits
HM-860
Specification for Multilayer Hybrid Circuits HM-860
DESCRIPTION Covers the qualification and performance requirements of multilayer circuits used in hybrid packaging. These circuits consist of three or more layers of conductor patterns separated from each other by insulating materials and interconnected by a continuous metallic interlayer connection. The substrate may include passive elements. 66 pages. Released January 1987.

DESCRIPTION
Covers the qualification and performance requirements of multilayer circuits used in hybrid packaging. These circuits consist of three or more layers of conductor patterns separated from each other by insulating materials and interconnected by a continuous metallic interlayer connection. The substrate may include passive elements. 66 pages. Released January 1987.

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Technical Specifications

  IPC International, Inc.
Product Category Standards and Technical Documents
Product Number HM-860
Product Name Specification for Multilayer Hybrid Circuits
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