IPC International, Inc. Design & Application Guidelines for the Use of Solderless Surface Mount Connectors CI-408

Description
Provides information on design characteristics and the application of solderless surface mount connectors, including conductive adhesives to aid IC package and board interconnection.
  • Design & Application Guidelines for the Use of Solderless Surface Mount Connectors - CI-408 - IPC International, Inc.
    IPC International, Inc.
Description
Provides information on design characteristics and the application of solderless surface mount connectors, including conductive adhesives to aid IC package and board interconnection.

Suppliers

Company
Product
Description
Supplier Links
Design & Application Guidelines for the Use of Solderless Surface Mount Connectors - CI-408 - IPC International, Inc.
IPC International, Inc.
Bannockburn, IL, United States
Design & Application Guidelines for the Use of Solderless Surface Mount Connectors
CI-408
Design & Application Guidelines for the Use of Solderless Surface Mount Connectors CI-408
Provides information on design characteristics and the application of solderless surface mount connectors, including conductive adhesives to aid IC package and board interconnection.

Provides information on design characteristics and the application of solderless surface mount connectors, including conductive adhesives to aid IC package and board interconnection.

Supplier's Site

Technical Specifications

  IPC International, Inc.
Product Category Standards and Technical Documents
Product Number CI-408
Product Name Design & Application Guidelines for the Use of Solderless Surface Mount Connectors
Unlock Full Specs
to access all available technical data

Similar Products