IPC International, Inc. Test Methods for Characterization of Printed Board Assembly Pad Cratering 9708

Description
DESCRIPTION Mechanical bend and shock tests are routinely performed on SMT assemblies to ensure that they can sustain anticipated production, handling and end use conditions. The strains and strain rates applied to SMT assemblies during bend and shock testing can lead to a variety of failure modes in the vicinity of the solder joints. This document provides test methods to evaluate the susceptibility of printed board assembly (PBA) materials and designs to cohesive dielectric failure underneath surface mount technology (SMT) attach pads. The test methods, which include pin-pull, ball-pull, and ball shear, can be used to rank order and compare different printed board materials and design parameters.17 pages. released December 2010.
  • Test Methods for Characterization of Printed Board Assembly Pad Cratering - 9708 - IPC International, Inc.
    IPC International, Inc.
Description
DESCRIPTION Mechanical bend and shock tests are routinely performed on SMT assemblies to ensure that they can sustain anticipated production, handling and end use conditions. The strains and strain rates applied to SMT assemblies during bend and shock testing can lead to a variety of failure modes in the vicinity of the solder joints. This document provides test methods to evaluate the susceptibility of printed board assembly (PBA) materials and designs to cohesive dielectric failure underneath surface mount technology (SMT) attach pads. The test methods, which include pin-pull, ball-pull, and ball shear, can be used to rank order and compare different printed board materials and design parameters.17 pages. released December 2010.

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Test Methods for Characterization of Printed Board Assembly Pad Cratering - 9708 - IPC International, Inc.
IPC International, Inc.
Bannockburn, IL, United States
Test Methods for Characterization of Printed Board Assembly Pad Cratering
9708
Test Methods for Characterization of Printed Board Assembly Pad Cratering 9708
DESCRIPTION Mechanical bend and shock tests are routinely performed on SMT assemblies to ensure that they can sustain anticipated production, handling and end use conditions. The strains and strain rates applied to SMT assemblies during bend and shock testing can lead to a variety of failure modes in the vicinity of the solder joints. This document provides test methods to evaluate the susceptibility of printed board assembly (PBA) materials and designs to cohesive dielectric failure underneath surface mount technology (SMT) attach pads. The test methods, which include pin-pull, ball-pull, and ball shear, can be used to rank order and compare different printed board materials and design parameters.17 pages. released December 2010.

DESCRIPTION

Mechanical bend and shock tests are routinely performed on SMT assemblies to ensure that they can sustain anticipated production, handling and end use conditions. The strains and strain rates applied to SMT assemblies during bend and shock testing can lead to a variety of failure modes in the vicinity of the solder joints. This document provides test methods to evaluate the susceptibility of printed board assembly (PBA) materials and designs to cohesive dielectric failure underneath surface mount technology (SMT) attach pads. The test methods, which include pin-pull, ball-pull, and ball shear, can be used to rank order and compare different printed board materials and design parameters.17 pages. released December 2010.

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Technical Specifications

  IPC International, Inc.
Product Category Standards and Technical Documents
Product Number 9708
Product Name Test Methods for Characterization of Printed Board Assembly Pad Cratering
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