DESCRIPTION
This standard on spherical transient bend testing is intended to characterize the maximum allowable strain that a surface mount component's board level interconnects can withstand in flexural loading. Whereas four-point monotonic bend test methods only address simple planar bending, spherical bend tests establish strain limits of board level interconnects under worst-case flexure conditions that can occur during conventional printed board/system assembly, manufacturing and test operations. This method is applicable to surface mounted BGA components larger than 15.0 mm on a side with organically based substrates, attached to printed boards using conventional solder reflow technologies. This document was developed cooperatively with JEDEC. 15 pages. Released 2011.
| IPC International, Inc. | |
|---|---|
| Product Category | Standards and Technical Documents |
| Product Number | 9707 |
| Product Name | Spherical Bend Test Method for Characterization of Board Level Interconnects |
