IPC International, Inc. IPC/JEDEC Monotonic Bend Characterization of Board-Level Interconnects 9702

Description
DESCRIPTION This publication is intended to characterize the fracture strength of a component's board level-interconnect by providing a common method of establishing the fracture resistance to flexural loading that may occur during conventional non-cyclic board assembly and test operations. The document is applicable to surface mount components attached to printed wiring boards using conventional solder reflow technologies and supplements existing standards that address mechanical shock or impact during shipping, handling or field operation. 14 pages. Released June 2004.
  • IPC/JEDEC Monotonic Bend Characterization of Board-Level Interconnects - 9702 - IPC International, Inc.
    IPC International, Inc.
Description
DESCRIPTION This publication is intended to characterize the fracture strength of a component's board level-interconnect by providing a common method of establishing the fracture resistance to flexural loading that may occur during conventional non-cyclic board assembly and test operations. The document is applicable to surface mount components attached to printed wiring boards using conventional solder reflow technologies and supplements existing standards that address mechanical shock or impact during shipping, handling or field operation. 14 pages. Released June 2004.

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IPC/JEDEC Monotonic Bend Characterization of Board-Level Interconnects - 9702 - IPC International, Inc.
IPC International, Inc.
Bannockburn, IL, United States
IPC/JEDEC Monotonic Bend Characterization of Board-Level Interconnects
9702
IPC/JEDEC Monotonic Bend Characterization of Board-Level Interconnects 9702
DESCRIPTION This publication is intended to characterize the fracture strength of a component's board level-interconnect by providing a common method of establishing the fracture resistance to flexural loading that may occur during conventional non-cyclic board assembly and test operations. The document is applicable to surface mount components attached to printed wiring boards using conventional solder reflow technologies and supplements existing standards that address mechanical shock or impact during shipping, handling or field operation. 14 pages. Released June 2004.

DESCRIPTION
This publication is intended to characterize the fracture strength of a component's board level-interconnect by providing a common method of establishing the fracture resistance to flexural loading that may occur during conventional non-cyclic board assembly and test operations. The document is applicable to surface mount components attached to printed wiring boards using conventional solder reflow technologies and supplements existing standards that address mechanical shock or impact during shipping, handling or field operation. 14 pages. Released June 2004.

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Technical Specifications

  IPC International, Inc.
Product Category Standards and Technical Documents
Product Number 9702
Product Name IPC/JEDEC Monotonic Bend Characterization of Board-Level Interconnects
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