IPC International, Inc. PWB Assembly Soldering Process Guideline for Electronic Components 9502

Description
DESCRIPTION This document describes the manufacturing solder process limits that components subjected to IPC-9501, IPC-9504 and IPC/JEDEC J-STD-020 would survive. It does not include optimum conditions for assembly, but provides guidelines to ensure components are not damaged. This document applies to both surface-mount (SM) and through-hole (TH) components that are wave soldered, reflowed or hand soldered. This document is intended to complement other industry documents. Note: This document does not address the increased temperature requirements of lead-free solders. 12 pages. Released April 1999.
  • PWB Assembly Soldering Process Guideline for Electronic Components - 9502 - IPC International, Inc.
    IPC International, Inc.
Description
DESCRIPTION This document describes the manufacturing solder process limits that components subjected to IPC-9501, IPC-9504 and IPC/JEDEC J-STD-020 would survive. It does not include optimum conditions for assembly, but provides guidelines to ensure components are not damaged. This document applies to both surface-mount (SM) and through-hole (TH) components that are wave soldered, reflowed or hand soldered. This document is intended to complement other industry documents. Note: This document does not address the increased temperature requirements of lead-free solders. 12 pages. Released April 1999.

Suppliers

Company
Product
Description
Supplier Links
PWB Assembly Soldering Process Guideline for Electronic Components - 9502 - IPC International, Inc.
IPC International, Inc.
Bannockburn, IL, United States
PWB Assembly Soldering Process Guideline for Electronic Components
9502
PWB Assembly Soldering Process Guideline for Electronic Components 9502
DESCRIPTION This document describes the manufacturing solder process limits that components subjected to IPC-9501, IPC-9504 and IPC/JEDEC J-STD-020 would survive. It does not include optimum conditions for assembly, but provides guidelines to ensure components are not damaged. This document applies to both surface-mount (SM) and through-hole (TH) components that are wave soldered, reflowed or hand soldered. This document is intended to complement other industry documents. Note: This document does not address the increased temperature requirements of lead-free solders. 12 pages. Released April 1999.


DESCRIPTION
This document describes the manufacturing solder process limits that components subjected to IPC-9501, IPC-9504 and IPC/JEDEC J-STD-020 would survive. It does not include optimum conditions for assembly, but provides guidelines to ensure components are not damaged. This document applies to both surface-mount (SM) and through-hole (TH) components that are wave soldered, reflowed or hand soldered. This document is intended to complement other industry documents. Note: This document does not address the increased temperature requirements of lead-free solders. 12 pages. Released April 1999.

Supplier's Site

Technical Specifications

  IPC International, Inc.
Product Category Standards and Technical Documents
Product Number 9502
Product Name PWB Assembly Soldering Process Guideline for Electronic Components
Unlock Full Specs
to access all available technical data

Similar Products