IPC International, Inc. PWB Assembly Process Simulation for Evaluation of Electronic Components 9501

Description
DESCRIPTION Will the components work with your process? That determination is the goal of these manufacturing process simulations; to ensure that components chosen meet expected reliability requirements after exposure to factory processes. This document specifically addresses preconditioning of components. Developed for users and manufacturers, the procedure consists of a set of simulations for IC component storage and use, wave and reflow soldering (SMT and PTH parts), exposure to corrosive (water soluble) fluxes and exposure to often-used cleaning materials. 25 pages. Released July 1995.
  • PWB Assembly Process Simulation for Evaluation of Electronic Components - 9501 - IPC International, Inc.
    IPC International, Inc.
Description
DESCRIPTION Will the components work with your process? That determination is the goal of these manufacturing process simulations; to ensure that components chosen meet expected reliability requirements after exposure to factory processes. This document specifically addresses preconditioning of components. Developed for users and manufacturers, the procedure consists of a set of simulations for IC component storage and use, wave and reflow soldering (SMT and PTH parts), exposure to corrosive (water soluble) fluxes and exposure to often-used cleaning materials. 25 pages. Released July 1995.

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PWB Assembly Process Simulation for Evaluation of Electronic Components - 9501 - IPC International, Inc.
IPC International, Inc.
Bannockburn, IL, United States
PWB Assembly Process Simulation for Evaluation of Electronic Components
9501
PWB Assembly Process Simulation for Evaluation of Electronic Components 9501
DESCRIPTION Will the components work with your process? That determination is the goal of these manufacturing process simulations; to ensure that components chosen meet expected reliability requirements after exposure to factory processes. This document specifically addresses preconditioning of components. Developed for users and manufacturers, the procedure consists of a set of simulations for IC component storage and use, wave and reflow soldering (SMT and PTH parts), exposure to corrosive (water soluble) fluxes and exposure to often-used cleaning materials. 25 pages. Released July 1995.

DESCRIPTION
Will the components work with your process? That determination is the goal of these manufacturing process simulations; to ensure that components chosen meet expected reliability requirements after exposure to factory processes. This document specifically addresses preconditioning of components. Developed for users and manufacturers, the procedure consists of a set of simulations for IC component storage and use, wave and reflow soldering (SMT and PTH parts), exposure to corrosive (water soluble) fluxes and exposure to often-used cleaning materials. 25 pages. Released July 1995.

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Technical Specifications

  IPC International, Inc.
Product Category Standards and Technical Documents
Product Number 9501
Product Name PWB Assembly Process Simulation for Evaluation of Electronic Components
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