IPC International, Inc. Design and Assembly Process Implementation for BGAs 7095B

Description
Implementing Ball Grid Array (BGA) and Fine-Pitch Ball Grid Array (FBGA) technology presents some unique challenges for design, assembly, inspection and repair personnel. IPC-7095B delivers useful and practical information to anyone currently using BGAs or considering a conversion to area array packaging formats.
Description
Implementing Ball Grid Array (BGA) and Fine-Pitch Ball Grid Array (FBGA) technology presents some unique challenges for design, assembly, inspection and repair personnel. IPC-7095B delivers useful and practical information to anyone currently using BGAs or considering a conversion to area array packaging formats.

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Product
Description
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Design and Assembly Process Implementation for BGAs - 7095B - IPC International, Inc.
Bannockburn, IL, United States
Design and Assembly Process Implementation for BGAs
7095B
Design and Assembly Process Implementation for BGAs 7095B
Implementing Ball Grid Array (BGA) and Fine-Pitch Ball Grid Array (FBGA) technology presents some unique challenges for design, assembly, inspection and repair personnel. IPC-7095B delivers useful and practical information to anyone currently using BGAs or considering a conversion to area array packaging formats.

Implementing Ball Grid Array (BGA) and Fine-Pitch Ball Grid Array (FBGA) technology presents some unique challenges for design, assembly, inspection and repair personnel. IPC-7095B delivers useful and practical information to anyone currently using BGAs or considering a conversion to area array packaging formats.

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Technical Specifications

  IPC International, Inc.
Product Category Standards and Technical Documents
Product Number 7095B
Product Name Design and Assembly Process Implementation for BGAs
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