IPC International, Inc. Resin Coated Copper Foil for Printed Boards Guideline 4563

Description
DESCRIPTION This guideline covers the requirements for resin coated copper foil intended for use in the formation of high density interconnect surface microvias for printed boards and printed board assemblies. 19 pages. Released November 2007.
  • Resin Coated Copper Foil for Printed Boards Guideline - 4563 - IPC International, Inc.
    IPC International, Inc.
Description
DESCRIPTION This guideline covers the requirements for resin coated copper foil intended for use in the formation of high density interconnect surface microvias for printed boards and printed board assemblies. 19 pages. Released November 2007.

Suppliers

Company
Product
Description
Supplier Links
Resin Coated Copper Foil for Printed Boards Guideline - 4563 - IPC International, Inc.
IPC International, Inc.
Bannockburn, IL, United States
Resin Coated Copper Foil for Printed Boards Guideline
4563
Resin Coated Copper Foil for Printed Boards Guideline 4563
DESCRIPTION This guideline covers the requirements for resin coated copper foil intended for use in the formation of high density interconnect surface microvias for printed boards and printed board assemblies. 19 pages. Released November 2007.

DESCRIPTION
This guideline covers the requirements for resin coated copper foil intended for use in the formation of high density interconnect surface microvias for printed boards and printed board assemblies. 19 pages. Released November 2007.

Supplier's Site

Technical Specifications

  IPC International, Inc.
Product Category Standards and Technical Documents
Product Number 4563
Product Name Resin Coated Copper Foil for Printed Boards Guideline
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