IPC International, Inc. Specification for High Density Interconnect (HDI) and Microvia Materials 4104

Description
DESCRIPTION Covers the various conductive and dielectric materials that can be used for the fabrication of HDI and microvias. The 23 specification sheets included in IPC/JPCA-4104 cover the qualification and conformance requirements for such materials as photoimageable dielectric dry films and liquids, epoxy blends and coated foils. IPC/JPCA-4104 also includes six new test methods developed specifically for the testing of HDI and microvia materials. 92 pages. Released May 1999.
  • Specification for High Density Interconnect (HDI) and Microvia Materials - 4104 - IPC International, Inc.
    IPC International, Inc.
Description
DESCRIPTION Covers the various conductive and dielectric materials that can be used for the fabrication of HDI and microvias. The 23 specification sheets included in IPC/JPCA-4104 cover the qualification and conformance requirements for such materials as photoimageable dielectric dry films and liquids, epoxy blends and coated foils. IPC/JPCA-4104 also includes six new test methods developed specifically for the testing of HDI and microvia materials. 92 pages. Released May 1999.

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Specification for High Density Interconnect (HDI) and Microvia Materials - 4104 - IPC International, Inc.
IPC International, Inc.
Bannockburn, IL, United States
Specification for High Density Interconnect (HDI) and Microvia Materials
4104
Specification for High Density Interconnect (HDI) and Microvia Materials 4104
DESCRIPTION Covers the various conductive and dielectric materials that can be used for the fabrication of HDI and microvias. The 23 specification sheets included in IPC/JPCA-4104 cover the qualification and conformance requirements for such materials as photoimageable dielectric dry films and liquids, epoxy blends and coated foils. IPC/JPCA-4104 also includes six new test methods developed specifically for the testing of HDI and microvia materials. 92 pages. Released May 1999.

DESCRIPTION
Covers the various conductive and dielectric materials that can be used for the fabrication of HDI and microvias. The 23 specification sheets included in IPC/JPCA-4104 cover the qualification and conformance requirements for such materials as photoimageable dielectric dry films and liquids, epoxy blends and coated foils. IPC/JPCA-4104 also includes six new test methods developed specifically for the testing of HDI and microvia materials. 92 pages. Released May 1999.

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Technical Specifications

  IPC International, Inc.
Product Category Standards and Technical Documents
Product Number 4104
Product Name Specification for High Density Interconnect (HDI) and Microvia Materials
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