IPC International, Inc. Optoelectronic Assembly and Packaging Technology 40

Description
DESCRIPTION ANSI Approved This document addresses the implementation of optical and optoelectronic packaging technologies. The areas discussed include: technology choices, design considerations, material properties, component mounting and interconnecting structures, assembly processes, testing, application, rework, and reliability of completed optoelectronic products. Optoelectronic packaging technologies include active and passive components and discrete fiber cable, their characteristics, and the manner that these parts will become an integral part of the functioning module, board or subassembly. 163 pages. Released May 2003.
  • Optoelectronic Assembly and Packaging Technology - 40 - IPC International, Inc.
    IPC International, Inc.
Description
DESCRIPTION ANSI Approved This document addresses the implementation of optical and optoelectronic packaging technologies. The areas discussed include: technology choices, design considerations, material properties, component mounting and interconnecting structures, assembly processes, testing, application, rework, and reliability of completed optoelectronic products. Optoelectronic packaging technologies include active and passive components and discrete fiber cable, their characteristics, and the manner that these parts will become an integral part of the functioning module, board or subassembly. 163 pages. Released May 2003.

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Product
Description
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Optoelectronic Assembly and Packaging Technology - 40 - IPC International, Inc.
IPC International, Inc.
Bannockburn, IL, United States
Optoelectronic Assembly and Packaging Technology
40
Optoelectronic Assembly and Packaging Technology 40
DESCRIPTION ANSI Approved This document addresses the implementation of optical and optoelectronic packaging technologies. The areas discussed include: technology choices, design considerations, material properties, component mounting and interconnecting structures, assembly processes, testing, application, rework, and reliability of completed optoelectronic products. Optoelectronic packaging technologies include active and passive components and discrete fiber cable, their characteristics, and the manner that these parts will become an integral part of the functioning module, board or subassembly. 163 pages. Released May 2003.

DESCRIPTION

ANSI Approved

This document addresses the implementation of optical and optoelectronic packaging technologies. The areas discussed include: technology choices, design considerations, material properties, component mounting and interconnecting structures, assembly processes, testing, application, rework, and reliability of completed optoelectronic products. Optoelectronic packaging technologies include active and passive components and discrete fiber cable, their characteristics, and the manner that these parts will become an integral part of the functioning module, board or subassembly. 163 pages. Released May 2003.

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Technical Specifications

  IPC International, Inc.
Product Category Standards and Technical Documents
Product Number 40
Product Name Optoelectronic Assembly and Packaging Technology
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