IPC International, Inc. Design Guide for RF/Microwave Circuit Boards 2252

Description
DESCRIPTION This design guideline provides RF and microwave circuit design engineers, printed circuit board engineers, packaging engineers and drafters with the information necessary to design practical, functional and cost effective microwave circuit boards in the frequency range of 100 MHz to 30 GHz. This guide also applies to operations in the region where distributed circuits are used instead of conventional lumped circuit elements. Released June 2002. 30 pages.
Description
DESCRIPTION This design guideline provides RF and microwave circuit design engineers, printed circuit board engineers, packaging engineers and drafters with the information necessary to design practical, functional and cost effective microwave circuit boards in the frequency range of 100 MHz to 30 GHz. This guide also applies to operations in the region where distributed circuits are used instead of conventional lumped circuit elements. Released June 2002. 30 pages.

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Design Guide for RF/Microwave Circuit Boards - 2252 - IPC International, Inc.
Bannockburn, IL, United States
Design Guide for RF/Microwave Circuit Boards
2252
Design Guide for RF/Microwave Circuit Boards 2252
DESCRIPTION This design guideline provides RF and microwave circuit design engineers, printed circuit board engineers, packaging engineers and drafters with the information necessary to design practical, functional and cost effective microwave circuit boards in the frequency range of 100 MHz to 30 GHz. This guide also applies to operations in the region where distributed circuits are used instead of conventional lumped circuit elements. Released June 2002. 30 pages.

DESCRIPTION

This design guideline provides RF and microwave circuit design engineers, printed circuit board engineers, packaging engineers and drafters with the information necessary to design practical, functional and cost effective microwave circuit boards in the frequency range of 100 MHz to 30 GHz. This guide also applies to operations in the region where distributed circuits are used instead of conventional lumped circuit elements. Released June 2002. 30 pages.

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Technical Specifications

  IPC International, Inc.
Product Category Standards and Technical Documents
Product Number 2252
Product Name Design Guide for RF/Microwave Circuit Boards
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