IPC International, Inc. Design Guide for the Packaging of High Speed Electronic Circuits 2251

Description
DESCRIPTION This guideline addresses the major factors influencing the design of high-speed circuitry. Considerations include electrical noise, electromagnetic interference, signal propagation time, impedance, thermo-mechanical environmental protection, and heat dissipation. Supersedes IPC-D-317A. Key improvements over the IPC-D-317A document include updated impedance models for embedded microstrip, centered stripline and dual stripline geometries, expanded EMI layout practices, signal integrity design constraints, enhanced graphics and updated terms and definitions. 99 pages. Released November 2003.
  • Design Guide for the Packaging of High Speed Electronic Circuits - 2251 - IPC International, Inc.
    IPC International, Inc.
Description
DESCRIPTION This guideline addresses the major factors influencing the design of high-speed circuitry. Considerations include electrical noise, electromagnetic interference, signal propagation time, impedance, thermo-mechanical environmental protection, and heat dissipation. Supersedes IPC-D-317A. Key improvements over the IPC-D-317A document include updated impedance models for embedded microstrip, centered stripline and dual stripline geometries, expanded EMI layout practices, signal integrity design constraints, enhanced graphics and updated terms and definitions. 99 pages. Released November 2003.

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Design Guide for the Packaging of High Speed Electronic Circuits - 2251 - IPC International, Inc.
IPC International, Inc.
Bannockburn, IL, United States
Design Guide for the Packaging of High Speed Electronic Circuits
2251
Design Guide for the Packaging of High Speed Electronic Circuits 2251
DESCRIPTION This guideline addresses the major factors influencing the design of high-speed circuitry. Considerations include electrical noise, electromagnetic interference, signal propagation time, impedance, thermo-mechanical environmental protection, and heat dissipation. Supersedes IPC-D-317A. Key improvements over the IPC-D-317A document include updated impedance models for embedded microstrip, centered stripline and dual stripline geometries, expanded EMI layout practices, signal integrity design constraints, enhanced graphics and updated terms and definitions. 99 pages. Released November 2003.

DESCRIPTION
This guideline addresses the major factors influencing the design of high-speed circuitry. Considerations include electrical noise, electromagnetic interference, signal propagation time, impedance, thermo-mechanical environmental protection, and heat dissipation. Supersedes IPC-D-317A. Key improvements over the IPC-D-317A document include updated impedance models for embedded microstrip, centered stripline and dual stripline geometries, expanded EMI layout practices, signal integrity design constraints, enhanced graphics and updated terms and definitions. 99 pages. Released November 2003.

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  IPC International, Inc.
Product Category Standards and Technical Documents
Product Number 2251
Product Name Design Guide for the Packaging of High Speed Electronic Circuits
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