IPC International, Inc. Sectional Design Standard for Flexible Printed Boards 2223D

Description
DESCRIPTION Used in conjunction with IPC-2221, IPC-2223 establishes the specific requirements for the design of flexible printed boards and forms of component mounting and interconnecting structures. The flexible materials used in the structures are comprised of insulating films, reinforced and/or non-reinforced dielectric in combination with metallic materials. Revision C provides new design guidance and requirements for bends, folds and creases, staggered flexible layer bands, and strain relief fillets. Also included is a new design tutorial providing guidance on material selection, size and shape of flexible circuits and fabrication allowances. 39 pages. Released 2011.
  • Sectional Design Standard for Flexible Printed Boards - 2223D - IPC International, Inc.
    IPC International, Inc.
Description
DESCRIPTION Used in conjunction with IPC-2221, IPC-2223 establishes the specific requirements for the design of flexible printed boards and forms of component mounting and interconnecting structures. The flexible materials used in the structures are comprised of insulating films, reinforced and/or non-reinforced dielectric in combination with metallic materials. Revision C provides new design guidance and requirements for bends, folds and creases, staggered flexible layer bands, and strain relief fillets. Also included is a new design tutorial providing guidance on material selection, size and shape of flexible circuits and fabrication allowances. 39 pages. Released 2011.

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Sectional Design Standard for Flexible Printed Boards - 2223D - IPC International, Inc.
IPC International, Inc.
Bannockburn, IL, United States
Sectional Design Standard for Flexible Printed Boards
2223D
Sectional Design Standard for Flexible Printed Boards 2223D
DESCRIPTION Used in conjunction with IPC-2221, IPC-2223 establishes the specific requirements for the design of flexible printed boards and forms of component mounting and interconnecting structures. The flexible materials used in the structures are comprised of insulating films, reinforced and/or non-reinforced dielectric in combination with metallic materials. Revision C provides new design guidance and requirements for bends, folds and creases, staggered flexible layer bands, and strain relief fillets. Also included is a new design tutorial providing guidance on material selection, size and shape of flexible circuits and fabrication allowances. 39 pages. Released 2011.

DESCRIPTION

Used in conjunction with IPC-2221, IPC-2223 establishes the specific requirements for the design of flexible printed boards and forms of component mounting and interconnecting structures. The flexible materials used in the structures are comprised of insulating films, reinforced and/or non-reinforced dielectric in combination with metallic materials. Revision C provides new design guidance and requirements for bends, folds and creases, staggered flexible layer bands, and strain relief fillets. Also included is a new design tutorial providing guidance on material selection, size and shape of flexible circuits and fabrication allowances. 39 pages. Released 2011.

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Technical Specifications

  IPC International, Inc.
Product Category Standards and Technical Documents
Product Number 2223D
Product Name Sectional Design Standard for Flexible Printed Boards
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