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inTEST Thermal Solutions Bench Top Temperature Test System ThermoSpot® Systems

Description
The Temptronic® ThermoSpot family of benchtop direct contact systems provide an efficient source for IC temperature characterization, including high-Watt emitting devices. Highly responsive and reliable, the unit feeds a thermal probe head through a flexible umbilical - without the use of thermoelectric modules. The thermal probe is designed with an interchangeable ThermoBridgeTM to mate directly to your IC or other device under test. Using proprietary, robust refrigeration technology ThermoSpot can perform thermal cycling without the worry of cooling degradation so common with thermoelectric modules employed in competitive systems. Furthermore, these systems provide the highest cooling capacity of direct contact systems on the market today.
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Bench Top Temperature Test System - ThermoSpot® Systems - inTEST Thermal Solutions
Mansfield, MA, United States
Bench Top Temperature Test System
ThermoSpot® Systems
Bench Top Temperature Test System ThermoSpot® Systems
The Temptronic® ThermoSpot family of benchtop direct contact systems provide an efficient source for IC temperature characterization, including high-Watt emitting devices. Highly responsive and reliable, the unit feeds a thermal probe head through a flexible umbilical - without the use of thermoelectric modules. The thermal probe is designed with an interchangeable ThermoBridgeTM to mate directly to your IC or other device under test. Using proprietary, robust refrigeration technology ThermoSpot can perform thermal cycling without the worry of cooling degradation so common with thermoelectric modules employed in competitive systems. Furthermore, these systems provide the highest cooling capacity of direct contact systems on the market today.

The Temptronic® ThermoSpot family of benchtop direct contact systems provide an efficient source for IC temperature characterization, including high-Watt emitting devices. Highly responsive and reliable, the unit feeds a thermal probe head through a flexible umbilical - without the use of thermoelectric modules. The thermal probe is designed with an interchangeable ThermoBridgeTM to mate directly to your IC or other device under test. Using proprietary, robust refrigeration technology ThermoSpot can perform thermal cycling without the worry of cooling degradation so common with thermoelectric modules employed in competitive systems. Furthermore, these systems provide the highest cooling capacity of direct contact systems on the market today.

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Technical Specifications

  inTEST Thermal Solutions
Product Category Automated Test Equipment
Product Number ThermoSpot® Systems
Product Name Bench Top Temperature Test System
Type / Form Module, Sub-system or ATE Component; Input Stimulus or Signal Source Unit
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