Intel Corporation Integrated Circuits (ICs) - Embedded - System On Chip (SoC) AGFB014R24B2I2V

Description
Win Source Part Number: 1339950-AGFB014R24B2 I2V Category: Integrated Circuits (ICs) - Embedded - System On Chip (SoC) Series: Agilex F Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Speed: 1.4GHz Package: Tray Standard Package: 1 Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 768 RAM Size: 256KB Architecture: MPU, FPGA Primary Attributes: FPGA - 1.4M Logic Elements Temperature Range - Operating: -40°C ~ 100°C (TJ) Fake Threat In the Open Market: 37 pct. MSL Level: 3 (168 Hours) Mfr: Intel
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Description
Win Source Part Number: 1339950-AGFB014R24B2 I2V Category: Integrated Circuits (ICs) - Embedded - System On Chip (SoC) Series: Agilex F Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Speed: 1.4GHz Package: Tray Standard Package: 1 Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 768 RAM Size: 256KB Architecture: MPU, FPGA Primary Attributes: FPGA - 1.4M Logic Elements Temperature Range - Operating: -40°C ~ 100°C (TJ) Fake Threat In the Open Market: 37 pct. MSL Level: 3 (168 Hours) Mfr: Intel
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Integrated Circuits (ICs) - Embedded - System On Chip (SoC) - 1339950-AGFB014R24B2I2V - Win Source Electronics
Laguna Hills, CA, United States
Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
1339950-AGFB014R24B2I2V
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) 1339950-AGFB014R24B2I2V
Win Source Part Number: 1339950-AGFB014R24B2 I2V Category: Integrated Circuits (ICs) - Embedded - System On Chip (SoC) Series: Agilex F Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Speed: 1.4GHz Package: Tray Standard Package: 1 Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 768 RAM Size: 256KB Architecture: MPU, FPGA Primary Attributes: FPGA - 1.4M Logic Elements Temperature Range - Operating: -40°C ~ 100°C (TJ) Fake Threat In the Open Market: 37 pct. MSL Level: 3 (168 Hours) Mfr: Intel

Win Source Part Number: 1339950-AGFB014R24B2I2V
Category: Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
Series: Agilex F
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed: 1.4GHz
Package: Tray
Standard Package: 1
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Number of I/O: 768
RAM Size: 256KB
Architecture: MPU, FPGA
Primary Attributes: FPGA - 1.4M Logic Elements
Temperature Range - Operating: -40°C ~ 100°C (TJ)
Fake Threat In the Open Market: 37 pct.
MSL Level: 3 (168 Hours)
Mfr: Intel

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Shenzhen, China
Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
AGFB014R24B2I2V
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) AGFB014R24B2I2V
IC FPGA AGILEX-F 2486FBGA

IC FPGA AGILEX-F 2486FBGA

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Technical Specifications

  Win Source Electronics Acme Chip Technology Co., Limited
Product Category System on a Chip (SoC) System on a Chip (SoC)
Product Number 1339950-AGFB014R24B2I2V AGFB014R24B2I2V
Product Name Integrated Circuits (ICs) - Embedded - System On Chip (SoC) Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
Processor Core ARM ARM
Package / Case Tray
RAM Size 0.2560 MB 0.2560 MB
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