Intel Corporation Integrated Circuits (ICs) - Embedded - System On Chip (SoC) 5CSXFC6D6F31C8N

Description
Manufacturer: Intel Win Source Part Number: 1318227-5CSXFC6D6F31 C8N Category: Integrated Circuits (ICs)>Embedded>Syste m On Chip (SoC) Packaging: Tray Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Speed: 600MHz Standard Package: 27 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Number of I/O: MCU - 181, FPGA - 288 RAM Size: 64KB Architecture: MCU, FPGA Primary Attributes: FPGA - 110K Logic Elements Supplier Device Package: 896-FBGA (31x31) Temperature Range - Operating: 0°C ~ 85°C (TJ) Case / Package: 896-BGA ECCN: 3A991D Fake Threat In the Open Market: 77 MSL Level: 3 (168 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Other Part Number: 544-3161,965731,5CSX FC6D6F31C8N-ND Base Product Number: 5CSXFC6 RoHS Status: RoHS Compliant
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Description
Manufacturer: Intel Win Source Part Number: 1318227-5CSXFC6D6F31 C8N Category: Integrated Circuits (ICs)>Embedded>Syste m On Chip (SoC) Packaging: Tray Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Speed: 600MHz Standard Package: 27 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Number of I/O: MCU - 181, FPGA - 288 RAM Size: 64KB Architecture: MCU, FPGA Primary Attributes: FPGA - 110K Logic Elements Supplier Device Package: 896-FBGA (31x31) Temperature Range - Operating: 0°C ~ 85°C (TJ) Case / Package: 896-BGA ECCN: 3A991D Fake Threat In the Open Market: 77 MSL Level: 3 (168 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Other Part Number: 544-3161,965731,5CSX FC6D6F31C8N-ND Base Product Number: 5CSXFC6 RoHS Status: RoHS Compliant
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Suppliers

Company
Product
Description
Supplier Links
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) - 1318227-5CSXFC6D6F31C8N - Win Source Electronics
Laguna Hills, CA, United States
Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
1318227-5CSXFC6D6F31C8N
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) 1318227-5CSXFC6D6F31C8N
Manufacturer: Intel Win Source Part Number: 1318227-5CSXFC6D6F31 C8N Category: Integrated Circuits (ICs)>Embedded>Syste m On Chip (SoC) Packaging: Tray Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Speed: 600MHz Standard Package: 27 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Number of I/O: MCU - 181, FPGA - 288 RAM Size: 64KB Architecture: MCU, FPGA Primary Attributes: FPGA - 110K Logic Elements Supplier Device Package: 896-FBGA (31x31) Temperature Range - Operating: 0°C ~ 85°C (TJ) Case / Package: 896-BGA ECCN: 3A991D Fake Threat In the Open Market: 77 MSL Level: 3 (168 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Other Part Number: 544-3161,965731,5CSX FC6D6F31C8N-ND Base Product Number: 5CSXFC6 RoHS Status: RoHS Compliant

Manufacturer: Intel
Win Source Part Number: 1318227-5CSXFC6D6F31C8N
Category: Integrated Circuits (ICs)>Embedded>System On Chip (SoC)
Packaging: Tray
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Speed: 600MHz
Standard Package: 27
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Number of I/O: MCU - 181, FPGA - 288
RAM Size: 64KB
Architecture: MCU, FPGA
Primary Attributes: FPGA - 110K Logic Elements
Supplier Device Package: 896-FBGA (31x31)
Temperature Range - Operating: 0°C ~ 85°C (TJ)
Case / Package: 896-BGA
ECCN: 3A991D
Fake Threat In the Open Market: 77
MSL Level: 3 (168 Hours)
REACH Status: REACH Unaffected
HTSUS: 8542.39.0001
Other Part Number: 544-3161,965731,5CSXFC6D6F31C8N-ND
Base Product Number: 5CSXFC6
RoHS Status: RoHS Compliant

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System On Chip (SoC) - 5CSXFC6D6F31C8N - ODG (Origin Data Global)
Shenzhen, China
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Buy Now Datasheet
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) - 5CSXFC6D6F31C8N - Shenzhen Shengyu Electronics Technology Limited
Futian, China
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Supplier's Site
System On Chip (SoC) - 5CSXFC6D6F31C8N - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
System On Chip (SoC)
5CSXFC6D6F31C8N
System On Chip (SoC) 5CSXFC6D6F31C8N
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Cyclone® V SX FPGA - 110K Logic Elements 600MHz 896-FBGA (31x31)

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Cyclone® V SX FPGA - 110K Logic Elements 600MHz 896-FBGA (31x31)

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Embedded - System On Chip (SoC) - 5CSXFC6D6F31C8N - Lingto Electronic Limited
Shenzhen, China
Embedded - System On Chip (SoC)
5CSXFC6D6F31C8N
Embedded - System On Chip (SoC) 5CSXFC6D6F31C8N
IC SOC CORTEX-A9 600MHZ 896FBGA

IC SOC CORTEX-A9 600MHZ 896FBGA

Supplier's Site Datasheet

Technical Specifications

  Win Source Electronics ODG (Origin Data Global) DigiKey Shenzhen Shengyu Electronics Technology Limited Quarktwin Technology Ltd. Lingto Electronic Limited
Product Category System on a Chip (SoC) System on a Chip (SoC) System on a Chip (SoC) System on a Chip (SoC) System on a Chip (SoC) System on a Chip (SoC)
Product Number 1318227-5CSXFC6D6F31C8N 5CSXFC6D6F31C8N 544-3161-ND 5CSXFC6D6F31C8N 5CSXFC6D6F31C8N 5CSXFC6D6F31C8N
Product Name Integrated Circuits (ICs) - Embedded - System On Chip (SoC) System On Chip (SoC) System On Chip (SoC) Integrated Circuits (ICs) - Embedded - System On Chip (SoC) System On Chip (SoC) Embedded - System On Chip (SoC)
Processor Core ARM Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ ARM ARM ARM; Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ ARM; Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
RAM Size 0.0640 MB 0.0640 MB 0.0640 MB 0.0640 MB 0.0640 MB
Operating Temperature 32 to 185 F (0.0 to 85 C) 32 to 185 F (0.0 to 85 C) 32 to 185 F (0.0 to 85 C) 32 to 185 F (0.0 to 85 C)
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