Intel Corporation Integrated Circuits (ICs) - Embedded - System On Chip (SoC) 5CSEBA6U23A7N

Description
Win Source Part Number: 1380960-5CSEBA6U23A7 N Category: Integrated Circuits (ICs)>Embedded>Syste m On Chip (SoC) Series: Automotive, AEC-Q100, Cyclone® V SE Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Speed: 700MHz Package: Tray Standard Package: 60 pcs Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Number of I/O: MCU - 181, FPGA - 145 RAM Size: 64KB Architecture: MCU, FPGA Primary Attributes: FPGA - 110K Logic Elements Package / Case: 672-FBGA Supplier Device Package: 672-UBGA (23x23) Temperature Range - Operating: -40°C ~ 125°C (TJ) ECCN: 3A001A7B Fake Threat In the Open Market: 50 pct. REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Mfr: Intel Base Product Number: 5CSEBA6 Moisture Sensitivity Level (MSL): 3 (168 Hours)
Request a Quote Datasheet
Description
Win Source Part Number: 1380960-5CSEBA6U23A7 N Category: Integrated Circuits (ICs)>Embedded>Syste m On Chip (SoC) Series: Automotive, AEC-Q100, Cyclone® V SE Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Speed: 700MHz Package: Tray Standard Package: 60 pcs Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Number of I/O: MCU - 181, FPGA - 145 RAM Size: 64KB Architecture: MCU, FPGA Primary Attributes: FPGA - 110K Logic Elements Package / Case: 672-FBGA Supplier Device Package: 672-UBGA (23x23) Temperature Range - Operating: -40°C ~ 125°C (TJ) ECCN: 3A001A7B Fake Threat In the Open Market: 50 pct. REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Mfr: Intel Base Product Number: 5CSEBA6 Moisture Sensitivity Level (MSL): 3 (168 Hours)
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) - 1380960-5CSEBA6U23A7N - Win Source Electronics
Laguna Hills, CA, United States
Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
1380960-5CSEBA6U23A7N
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) 1380960-5CSEBA6U23A7N
Win Source Part Number: 1380960-5CSEBA6U23A7 N Category: Integrated Circuits (ICs)>Embedded>Syste m On Chip (SoC) Series: Automotive, AEC-Q100, Cyclone® V SE Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Speed: 700MHz Package: Tray Standard Package: 60 pcs Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Number of I/O: MCU - 181, FPGA - 145 RAM Size: 64KB Architecture: MCU, FPGA Primary Attributes: FPGA - 110K Logic Elements Package / Case: 672-FBGA Supplier Device Package: 672-UBGA (23x23) Temperature Range - Operating: -40°C ~ 125°C (TJ) ECCN: 3A001A7B Fake Threat In the Open Market: 50 pct. REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Mfr: Intel Base Product Number: 5CSEBA6 Moisture Sensitivity Level (MSL): 3 (168 Hours)

Win Source Part Number: 1380960-5CSEBA6U23A7N
Category: Integrated Circuits (ICs)>Embedded>System On Chip (SoC)
Series: Automotive, AEC-Q100, Cyclone® V SE
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Speed: 700MHz
Package: Tray
Standard Package: 60 pcs
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Number of I/O: MCU - 181, FPGA - 145
RAM Size: 64KB
Architecture: MCU, FPGA
Primary Attributes: FPGA - 110K Logic Elements
Package / Case: 672-FBGA
Supplier Device Package: 672-UBGA (23x23)
Temperature Range - Operating: -40°C ~ 125°C (TJ)
ECCN: 3A001A7B
Fake Threat In the Open Market: 50 pct.
REACH Status: REACH Unaffected
HTSUS: 8542.39.0001
Mfr: Intel
Base Product Number: 5CSEBA6
Moisture Sensitivity Level (MSL): 3 (168 Hours)

Buy Now Datasheet
System On Chip (SoC) - 5CSEBA6U23A7N-ND - DigiKey
Thief River Falls, MN, United States
System On Chip (SoC)
5CSEBA6U23A7N-ND
System On Chip (SoC) 5CSEBA6U23A7N-ND
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Automotive, AEC-Q100, Cyclone® V SE FPGA - 110K Logic Elements 700MHz 672-UBGA (23x23)

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Automotive, AEC-Q100, Cyclone® V SE FPGA - 110K Logic Elements 700MHz 672-UBGA (23x23)

Buy Now Datasheet
System On Chip (SoC) - 5CSEBA6U23A7N - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
System On Chip (SoC)
5CSEBA6U23A7N
System On Chip (SoC) 5CSEBA6U23A7N
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Automotive, AEC-Q100, Cyclone® V SE FPGA - 110K Logic Elements 700MHz 672-UBGA (23x23)

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Automotive, AEC-Q100, Cyclone® V SE FPGA - 110K Logic Elements 700MHz 672-UBGA (23x23)

Buy Now
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) - 5CSEBA6U23A7N - Shenzhen Shengyu Electronics Technology Limited
Futian, China
Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
5CSEBA6U23A7N
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) 5CSEBA6U23A7N
IC SOC CORTEX-A9 700MHZ 672UBGA

IC SOC CORTEX-A9 700MHZ 672UBGA

Supplier's Site
Embedded - System On Chip (SoC) - 5CSEBA6U23A7N - Lingto Electronic Limited
Shenzhen, China
Embedded - System On Chip (SoC)
5CSEBA6U23A7N
Embedded - System On Chip (SoC) 5CSEBA6U23A7N
IC SOC CORTEX-A9 700MHZ 672UBGA

IC SOC CORTEX-A9 700MHZ 672UBGA

Supplier's Site Datasheet

Technical Specifications

  Win Source Electronics DigiKey Quarktwin Technology Ltd. Shenzhen Shengyu Electronics Technology Limited Lingto Electronic Limited
Product Category System on a Chip (SoC) System on a Chip (SoC) System on a Chip (SoC) System on a Chip (SoC) System on a Chip (SoC)
Product Number 1380960-5CSEBA6U23A7N 5CSEBA6U23A7N-ND 5CSEBA6U23A7N 5CSEBA6U23A7N 5CSEBA6U23A7N
Product Name Integrated Circuits (ICs) - Embedded - System On Chip (SoC) System On Chip (SoC) System On Chip (SoC) Integrated Circuits (ICs) - Embedded - System On Chip (SoC) Embedded - System On Chip (SoC)
Processor Core ARM ARM ARM; Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ ARM ARM; Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Package / Case Tray 672-FBGA 672-FBGA
RAM Size 0.0640 MB 0.0640 MB 0.0640 MB 0.0640 MB
Unlock Full Specs
to access all available technical data

Similar Products

Specs
Processor Core ARM
Clock Frequency 1200 MHz
Operating Temperature 32 to 212 F (0.0 to 100 C)
View Details
 - CY8C4245PVI-482 - Rochester Electronics
Infineon Technologies AG
View Details