Manufacturer: Intel
Win Source Part Number: 1323168-10AS016E3F29
Category: Integrated Circuits (ICs)>Embedded>Syste
Packaging: Tray
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Speed: 1.5GHz
Standard Package: 1
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Number of I/O: 288
RAM Size: 256KB
Architecture: MCU, FPGA
Primary Attributes: FPGA - 160K Logic Elements
Supplier Device Package: 780-FBGA, FC (29x29)
Temperature Range - Operating: -40°C ~ 100°C (TJ)
Case / Package: 780-BBGA, FCBGA
ECCN: 5A002A1
Fake Threat In the Open Market: 74
MSL Level: 3 (168 Hours)
REACH Status: REACH Unaffected
HTSUS: 8542.39.0001
Other Part Number: 10AS016E3F29I2SG-ND,
RoHS Status: RoHS Compliant
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Arria 10 SX FPGA - 160K Logic Elements 1.5GHz 780-FBGA, FC (29x29)
IC SOC CORTEX-A9 1.5GHZ 780FBGA
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Arria 10 SX FPGA - 160K Logic Elements 1.5GHz 780-FBGA, FC (29x29)
Dual ARM Cortex-A9 MPCore??with CoreSight??System On Chip (SOC) IC series FPGA - 160K Logic Elements 1.5GHz 780-FBGA, FC (29x29)
IC SOC CORTEX-A9 1.5GHZ 780FBGA
IC SOC CORTEX-A9 1.5GHZ 780FBGA
| Win Source Electronics | DigiKey | Shenzhen Shengyu Electronics Technology Limited | Quarktwin Technology Ltd. | Nova Technology(HK) Co.,Ltd | LIXINC Electronics Co., Limited | Lingto Electronic Limited | |
|---|---|---|---|---|---|---|---|
| Product Category | System on a Chip (SoC) | System on a Chip (SoC) | System on a Chip (SoC) | System on a Chip (SoC) | System on a Chip (SoC) | System on a Chip (SoC) | System on a Chip (SoC) |
| Product Number | 1323168-10AS016E3F29I2SG | 544-3615-ND | 10AS016E3F29I2SG | 10AS016E3F29I2SG | 10AS016E3F29I2SG | 10AS016E3F29I2SG | 10AS016E3F29I2SG |
| Product Name | Integrated Circuits (ICs) - Embedded - System On Chip (SoC) | System On Chip (SoC) | Integrated Circuits (ICs) - Embedded - System On Chip (SoC) | System On Chip (SoC) | Embedded - System On Chip (SoC) | Integrated Circuits | Embedded - System On Chip (SoC) |
| Processor Core | ARM | ARM | ARM | ARM; Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | ARM | ARM; Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | |
| RAM Size | 0.2560 MB | 0.2560 MB | 0.2560 MB | 0.2560 MB | 0.2560 MB | ||
| Number of Inputs/Outputs | 288 # | 288 # | |||||
| Operating Temperature | -40 to 212 F (-40 to 100 C) | -40 to 212 F (-40 to 100 C) | -40 to 212 F (-40 to 100 C) | -40 to 212 F (-40 to 100 C) |
