Intel Corporation Integrated Circuits (ICs) - Embedded - System On Chip (SoC) 10AS016E3F29I2SG

Description
Manufacturer: Intel Win Source Part Number: 1323168-10AS016E3F29 I2SG Category: Integrated Circuits (ICs)>Embedded>Syste m On Chip (SoC) Packaging: Tray Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Speed: 1.5GHz Standard Package: 1 Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Number of I/O: 288 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: FPGA - 160K Logic Elements Supplier Device Package: 780-FBGA, FC (29x29) Temperature Range - Operating: -40°C ~ 100°C (TJ) Case / Package: 780-BBGA, FCBGA ECCN: 5A002A1 Fake Threat In the Open Market: 74 MSL Level: 3 (168 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Other Part Number: 10AS016E3F29I2SG-ND, 964682,544-3615 RoHS Status: RoHS Compliant
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Description
Manufacturer: Intel Win Source Part Number: 1323168-10AS016E3F29 I2SG Category: Integrated Circuits (ICs)>Embedded>Syste m On Chip (SoC) Packaging: Tray Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Speed: 1.5GHz Standard Package: 1 Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Number of I/O: 288 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: FPGA - 160K Logic Elements Supplier Device Package: 780-FBGA, FC (29x29) Temperature Range - Operating: -40°C ~ 100°C (TJ) Case / Package: 780-BBGA, FCBGA ECCN: 5A002A1 Fake Threat In the Open Market: 74 MSL Level: 3 (168 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Other Part Number: 10AS016E3F29I2SG-ND, 964682,544-3615 RoHS Status: RoHS Compliant
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Suppliers

Company
Product
Description
Supplier Links
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) - 1323168-10AS016E3F29I2SG - Win Source Electronics
Laguna Hills, CA, United States
Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
1323168-10AS016E3F29I2SG
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) 1323168-10AS016E3F29I2SG
Manufacturer: Intel Win Source Part Number: 1323168-10AS016E3F29 I2SG Category: Integrated Circuits (ICs)>Embedded>Syste m On Chip (SoC) Packaging: Tray Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Speed: 1.5GHz Standard Package: 1 Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Number of I/O: 288 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: FPGA - 160K Logic Elements Supplier Device Package: 780-FBGA, FC (29x29) Temperature Range - Operating: -40°C ~ 100°C (TJ) Case / Package: 780-BBGA, FCBGA ECCN: 5A002A1 Fake Threat In the Open Market: 74 MSL Level: 3 (168 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Other Part Number: 10AS016E3F29I2SG-ND, 964682,544-3615 RoHS Status: RoHS Compliant

Manufacturer: Intel
Win Source Part Number: 1323168-10AS016E3F29I2SG
Category: Integrated Circuits (ICs)>Embedded>System On Chip (SoC)
Packaging: Tray
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Speed: 1.5GHz
Standard Package: 1
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Number of I/O: 288
RAM Size: 256KB
Architecture: MCU, FPGA
Primary Attributes: FPGA - 160K Logic Elements
Supplier Device Package: 780-FBGA, FC (29x29)
Temperature Range - Operating: -40°C ~ 100°C (TJ)
Case / Package: 780-BBGA, FCBGA
ECCN: 5A002A1
Fake Threat In the Open Market: 74
MSL Level: 3 (168 Hours)
REACH Status: REACH Unaffected
HTSUS: 8542.39.0001
Other Part Number: 10AS016E3F29I2SG-ND,964682,544-3615
RoHS Status: RoHS Compliant

Buy Now Datasheet
System On Chip (SoC) - 544-3615-ND - DigiKey
Thief River Falls, MN, United States
System On Chip (SoC)
544-3615-ND
System On Chip (SoC) 544-3615-ND
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Arria 10 SX FPGA - 160K Logic Elements 1.5GHz 780-FBGA, FC (29x29)

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Arria 10 SX FPGA - 160K Logic Elements 1.5GHz 780-FBGA, FC (29x29)

Buy Now Datasheet
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) - 10AS016E3F29I2SG - Shenzhen Shengyu Electronics Technology Limited
Futian, China
Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
10AS016E3F29I2SG
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) 10AS016E3F29I2SG
IC SOC CORTEX-A9 1.5GHZ 780FBGA

IC SOC CORTEX-A9 1.5GHZ 780FBGA

Supplier's Site
System On Chip (SoC) - 10AS016E3F29I2SG - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
System On Chip (SoC)
10AS016E3F29I2SG
System On Chip (SoC) 10AS016E3F29I2SG
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Arria 10 SX FPGA - 160K Logic Elements 1.5GHz 780-FBGA, FC (29x29)

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Arria 10 SX FPGA - 160K Logic Elements 1.5GHz 780-FBGA, FC (29x29)

Buy Now Datasheet
Embedded - System On Chip (SoC) - 10AS016E3F29I2SG - Lingto Electronic Limited
Shenzhen, China
Embedded - System On Chip (SoC)
10AS016E3F29I2SG
Embedded - System On Chip (SoC) 10AS016E3F29I2SG
IC SOC CORTEX-A9 1.5GHZ 780FBGA

IC SOC CORTEX-A9 1.5GHZ 780FBGA

Supplier's Site Datasheet

Technical Specifications

  Win Source Electronics DigiKey Shenzhen Shengyu Electronics Technology Limited Quarktwin Technology Ltd. Lingto Electronic Limited
Product Category System on a Chip (SoC) System on a Chip (SoC) System on a Chip (SoC) System on a Chip (SoC) System on a Chip (SoC)
Product Number 1323168-10AS016E3F29I2SG 544-3615-ND 10AS016E3F29I2SG 10AS016E3F29I2SG 10AS016E3F29I2SG
Product Name Integrated Circuits (ICs) - Embedded - System On Chip (SoC) System On Chip (SoC) Integrated Circuits (ICs) - Embedded - System On Chip (SoC) System On Chip (SoC) Embedded - System On Chip (SoC)
Processor Core ARM ARM ARM ARM; Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ ARM; Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
RAM Size 0.2560 MB 0.2560 MB 0.2560 MB 0.2560 MB
Number of Inputs/Outputs 288 # 288 #
Operating Temperature -40 to 212 F (-40 to 100 C) -40 to 212 F (-40 to 100 C) -40 to 212 F (-40 to 100 C) -40 to 212 F (-40 to 100 C)
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