The IS61QDB22M18-250M3I is a 36 Mb synchronous SRAM from Quarktwin Technology Ltd., featuring a 2M x 18 organization. It operates at a speed of 250 MHz and utilizes a double data rate (DDR) interface for both read and write operations. The device supports separate read and write ports, allowing for concurrent operations, and includes an on-chip delay-locked loop (DLL) to enhance data validity. This SRAM is packaged in a fine ball grid array (FBGA) format with a body size of 15mm x 17mm and a 1mm pitch, accommodating 165 balls. It operates with a core power supply of +1.8V and supports HSTL input/output levels. The device also features programmable impedance output drivers and supports byte write capabilities, enabling selective writing on a per-byte basis. The IS61QDB22M18-250M3I is suitable for applications requiring high-speed memory with efficient data handling and is tested for industrial temperature ranges from -40¬8C to +85¬8C.
SRAM - Synchronous, QUAD Memory IC 36Mb (2M x 18) Parallel 250MHz 1.35ns 165-LFBGA (15x17)
IC SRAM 36MBIT PARALLEL 165LFBGA Product overview: IS61QDB22M18-250M3I from Integrated Silicon Solution, Inc. (ISSI) is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include key electrical ratings, package details, and application requirements. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-IS61QDB22M18-250
Manufacturer: ISSI, Integrated Silicon Solution Inc
Win Source Part Number: 875486-IS61QDB22M18-
Operating Temperature Range: -40°C ~ 85°C (TA)
Features: SRAM - Synchronous, QUAD Memory IC 36Mb (2M x 18) Parallel 165-LFBGA (15x17)
Package: Tray
Package: 165-LBGA
Mounting: Surface Mount
Part Status: Obsolete
Categories: Integrated Circuits (ICs)
Case / Package: 165-LFBGA (15x17)
ECCN: OBSOLETE
Popularity: Medium
Fake Threat In the Open Market: 49 pct.
Supply and Demand Status: Limited
Quantity per package: 105
MSL Level: 3 (168 Hours)
REACH Status: REACH Unaffected
IC SRAM 36MBIT PARALLEL 165LFBGA
IC SRAM 36MBIT PARALLEL 165LFBGA
SRAM - Synchronous, QUAD Memory IC 36Mbit Parallel 250 MHz 1.35 ns 165-LFBGA (15x17)
| DigiKey | ERSAELECTRONICS PTE. LTD. | Win Source Electronics | Shenzhen Shengyu Electronics Technology Limited | Lingto Electronic Limited | Quarktwin Technology Ltd. | |
|---|---|---|---|---|---|---|
| Product Category | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips |
| Product Number | 706-IS61QDB22M18-250M3I-ND | 774-IS61QDB22M18-250M3I | 875486-IS61QDB22M18-250M3I | IS61QDB22M18-250M3I | IS61QDB22M18-250M3I | IS61QDB22M18-250M3I |
| Product Name | Memory | Memory IC and Storage Component | Memory - SRAM - IS61QDB22M18-250M3I | Integrated Circuits (ICs) - Memory - Memory | Memory | Memory |
| Memory Category | SRAM Chip | Volatile; SRAM Chip | SRAM Chip | Volatile; SRAM Chip | SRAM; SRAM Chip | SRAM; SRAM Chip |
| Operating Temperature | -40 to 85 C (-40 to 185 F) | -40 to 85 C (-40 to 185 F) | -40 to 85 C (-40 to 185 F) | -40 to 85 C (-40 to 185 F) | ||
| Density | 36000 kbits | 36000 kbits | 36000 kbits | 36000 kbits | ||
| Package Type | 165-LBGA | BGA; Tray | BGA; 165-LFBGA (15x17) | BGA | BGA; 165-LBGA |
