The IS61DDB22M18A-250B4LI is a 36Mb synchronous static random access memory (SRAM) device from Quarktwin Technology Ltd., featuring a 2Mx18 configuration. It operates at a clock speed of 250 MHz and utilizes a double data rate (DDR) interface for efficient read and write operations. The device supports a common I/O bus and includes an on-chip delay-locked loop (DLL) to enhance data validity. This SRAM is designed for high-performance applications, with self-timed internal operations and registered addresses for read and write controls. It operates with a core power supply of +1.8V and a VDDQ range of 1.5V to 1.8V, making it compatible with HSTL I/O interfaces. The package is a fine ball grid array (FBGA) with dimensions of 13mm x 15mm and includes 165 balls. The device also features byte write capabilities, boundary scan support using JTAG functions, and programmable impedance output drivers. It is suitable for industrial applications with an operating temperature range of -40¬8C to +85¬8C.
SRAM - Synchronous, DDR II Memory IC 36Mb (2M x 18) Parallel 250MHz 8.4ns 165-LFBGA (13x15)
36Mb, DDR II (Burst of 2) CIO, Sync SRAM, 2M x 18, 165 Ball FBGA (13x15 mm), RoHS
SRAM - Synchronous, DDR II Memory IC 36Mbit Parallel 250 MHz 8.4 ns 165-LFBGA (13x15)
IC SRAM 36MBIT PARALLEL 165LFBGA
IC SRAM 36MBIT PARALLEL 165LFBGA
| DigiKey | Newark, An Avnet Company | Quarktwin Technology Ltd. | Shenzhen Shengyu Electronics Technology Limited | Lingto Electronic Limited | |
|---|---|---|---|---|---|
| Product Category | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips |
| Product Number | IS61DDB22M18A-250B4LI-ND | 18W6942 | IS61DDB22M18A-250B4LI | IS61DDB22M18A-250B4LI | IS61DDB22M18A-250B4LI |
| Product Name | Memory | 36Mb, Ddr Ii (Burst Of 2) Cio, Sync Sram, 2M X 18, 165 Ball Fbga (13X15 Mm), Rohs Integrated Silicon Solution (Issi) | Memory | Integrated Circuits (ICs) - Memory - Memory | Memory |
| Memory Category | SRAM Chip | SRAM Chip | SRAM; SRAM Chip | Volatile; SRAM Chip | SRAM; SRAM Chip |
| Operating Temperature | -40 to 85 C (-40 to 185 F) | -40 to 85 C (-40 to 185 F) | |||
| Density | 36000 kbits | 36000 kbits | 36000 kbits | 36000 kbits | |
| Package Type | 165-LBGA | BGA; 165-LBGA | BGA |
