Integrated Silicon Solution, Inc. Integrated Circuits (ICs) - Memory - Memory IS43LD32640C-25BLI

Description
2G, 1.2/1.8V, LPDDR2, 64Mx32, 40
Datasheet
Description
2G, 1.2/1.8V, LPDDR2, 64Mx32, 40
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Shenzhen, China
Integrated Circuits (ICs) - Memory - Memory
IS43LD32640C-25BLI
Integrated Circuits (ICs) - Memory - Memory IS43LD32640C-25BLI
2G, 1.2/1.8V, LPDDR2, 64Mx32, 40

2G, 1.2/1.8V, LPDDR2, 64Mx32, 40

Supplier's Site
Memory - IS43LD32640C-25BLI - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
SDRAM - Mobile LPDDR2-S4 Memory IC 2Gbit HSUL_12 400 MHz 5.5 ns 134-TFBGA (10x11.5)

SDRAM - Mobile LPDDR2-S4 Memory IC 2Gbit HSUL_12 400 MHz 5.5 ns 134-TFBGA (10x11.5)

Buy Now Datasheet

Technical Specifications

  Acme Chip Technology Co., Limited Quarktwin Technology Ltd.
Product Category Memory Chips Memory Chips
Product Number IS43LD32640C-25BLI IS43LD32640C-25BLI
Product Name Integrated Circuits (ICs) - Memory - Memory Memory
Memory Category Surface Mount DRAM; DRAM Chip
Package Type 5.5 ns BGA; 134-TFBGA
Supply Voltage 15ns 1.14V ~ 1.3V, 1.7V ~ 1.95V
Unlock Full Specs
to access all available technical data

Similar Products

Memories - Radiation hardened and high-reliability memories - Space Memories - 5962R1821601VXC - 5962R1821601VXC - Infineon Technologies AG
Specs
Operating Temperature -55 to 125 C (-67 to 257 F)
Density 2000 kbits
Package Type CG-SSOP-16
View Details
Memory - MYX4DD3K128M64PBG2 - Micross Components, Inc.
Micross Components, Inc.
Specs
Memory Category DDR3
Operating Temperature -55 to 125 C (-67 to 257 F)
Density 1024000 kbits
View Details
Memory - 0418A4ACLAA-5 - Lingto Electronic Limited
Rochester Electronics
Specs
Memory Category SRAM; SRAM Chip
Access Time 5 ns
Density 4000 kbits
View Details