Integrated Silicon Solution, Inc. Memory - SDRAM - IS43DR82560B-25EBLI IS43DR82560B-25EBLI

Description
Manufacturer: ISSI, Integrated Silicon Solution Inc Win Source Part Number: 875414-IS43DR82560B- 25EBLI Operating Temperature Range: -40°C ~ 85°C (TA) Features: SDRAM - DDR2 Memory IC 2Gb (256M x 8) Parallel 400 MHz 400 ps 60-TWBGA (10.5x13) Package: Tray Package: 60-TFBGA Mounting: Surface Mount Family Name: IS43DR82560 Categories: Integrated Circuits (ICs) Case / Package: 60-TWBGA (10.5x13) ECCN: EAR99 Popularity: Medium Fake Threat In the Open Market: 47 pct. Supply and Demand Status: Limited Quantity per package: 136 MSL Level: 3 (168 Hours) REACH Status: REACH Unaffected HTSUS: 8542.32.0036
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Description
Manufacturer: ISSI, Integrated Silicon Solution Inc Win Source Part Number: 875414-IS43DR82560B- 25EBLI Operating Temperature Range: -40°C ~ 85°C (TA) Features: SDRAM - DDR2 Memory IC 2Gb (256M x 8) Parallel 400 MHz 400 ps 60-TWBGA (10.5x13) Package: Tray Package: 60-TFBGA Mounting: Surface Mount Family Name: IS43DR82560 Categories: Integrated Circuits (ICs) Case / Package: 60-TWBGA (10.5x13) ECCN: EAR99 Popularity: Medium Fake Threat In the Open Market: 47 pct. Supply and Demand Status: Limited Quantity per package: 136 MSL Level: 3 (168 Hours) REACH Status: REACH Unaffected HTSUS: 8542.32.0036
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Memory - SDRAM - IS43DR82560B-25EBLI - 875414-IS43DR82560B-25EBLI - Win Source Electronics
Laguna Hills, CA, United States
Memory - SDRAM - IS43DR82560B-25EBLI
875414-IS43DR82560B-25EBLI
Memory - SDRAM - IS43DR82560B-25EBLI 875414-IS43DR82560B-25EBLI
Manufacturer: ISSI, Integrated Silicon Solution Inc Win Source Part Number: 875414-IS43DR82560B- 25EBLI Operating Temperature Range: -40°C ~ 85°C (TA) Features: SDRAM - DDR2 Memory IC 2Gb (256M x 8) Parallel 400 MHz 400 ps 60-TWBGA (10.5x13) Package: Tray Package: 60-TFBGA Mounting: Surface Mount Family Name: IS43DR82560 Categories: Integrated Circuits (ICs) Case / Package: 60-TWBGA (10.5x13) ECCN: EAR99 Popularity: Medium Fake Threat In the Open Market: 47 pct. Supply and Demand Status: Limited Quantity per package: 136 MSL Level: 3 (168 Hours) REACH Status: REACH Unaffected HTSUS: 8542.32.0036

Manufacturer: ISSI, Integrated Silicon Solution Inc
Win Source Part Number: 875414-IS43DR82560B-25EBLI
Operating Temperature Range: -40°C ~ 85°C (TA)
Features: SDRAM - DDR2 Memory IC 2Gb (256M x 8) Parallel 400 MHz 400 ps 60-TWBGA (10.5x13)
Package: Tray
Package: 60-TFBGA
Mounting: Surface Mount
Family Name: IS43DR82560
Categories: Integrated Circuits (ICs)
Case / Package: 60-TWBGA (10.5x13)
ECCN: EAR99
Popularity: Medium
Fake Threat In the Open Market: 47 pct.
Supply and Demand Status: Limited
Quantity per package: 136
MSL Level: 3 (168 Hours)
REACH Status: REACH Unaffected
HTSUS: 8542.32.0036

Buy Now Datasheet
Memory IC and Storage Component - 774-IS43DR82560B-25EBLI - ERSAELECTRONICS PTE. LTD.
Singapore
Memory IC and Storage Component
774-IS43DR82560B-25EBLI
Memory IC and Storage Component 774-IS43DR82560B-25EBLI
IC DRAM 2GBIT PARALLEL 60TWBGA Product overview: IS43DR82560B-25EBLI from Integrated Silicon Solution, Inc. (ISSI) is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include key electrical ratings, package details, and application requirements. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-IS43DR82560B-25E BLI can be used for catalog matching and distributor lookup.

IC DRAM 2GBIT PARALLEL 60TWBGA Product overview: IS43DR82560B-25EBLI from Integrated Silicon Solution, Inc. (ISSI) is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include key electrical ratings, package details, and application requirements. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-IS43DR82560B-25EBLI can be used for catalog matching and distributor lookup.

Supplier's Site Datasheet
Memory - IS43DR82560B-25EBLI - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
SDRAM - DDR2 Memory IC 2Gbit Parallel 400 MHz 400 ps 60-TWBGA (10.5x13)

SDRAM - DDR2 Memory IC 2Gbit Parallel 400 MHz 400 ps 60-TWBGA (10.5x13)

Buy Now Datasheet
IC DRAM 2GBIT PARALLEL 60TWBGA

IC DRAM 2GBIT PARALLEL 60TWBGA

Supplier's Site Datasheet
Integrated Circuits (ICs) - Memory - IS43DR82560B-25EBLI - Shenzhen Shengyu Electronics Technology Limited
Futian, China
Integrated Circuits (ICs) - Memory
IS43DR82560B-25EBLI
Integrated Circuits (ICs) - Memory IS43DR82560B-25EBLI
IC DRAM 2GBIT PARALLEL 60TWBGA

IC DRAM 2GBIT PARALLEL 60TWBGA

Supplier's Site

Technical Specifications

  Win Source Electronics ERSAELECTRONICS PTE. LTD. Quarktwin Technology Ltd. Lingto Electronic Limited Shenzhen Shengyu Electronics Technology Limited
Product Category Memory Chips Memory Chips Memory Chips Memory Chips Memory Chips
Product Number 875414-IS43DR82560B-25EBLI 774-IS43DR82560B-25EBLI IS43DR82560B-25EBLI IS43DR82560B-25EBLI IS43DR82560B-25EBLI
Product Name Memory - SDRAM - IS43DR82560B-25EBLI Memory IC and Storage Component Memory Memory Integrated Circuits (ICs) - Memory
Memory Category DRAM Chip Volatile; DRAM Chip DRAM; DRAM Chip DRAM; DRAM Chip Volatile; DRAM Chip
Operating Temperature -40 to 85 C (-40 to 185 F) -40 to 85 C (-40 to 185 F) -40 to 85 C (-40 to 185 F) -40 to 85 C (-40 to 185 F)
Package Type BGA; 60-TWBGA (10.5x13) BGA; Tray BGA; 60-TFBGA BGA
Access Time 0.4000 ns 0.4000 ns 0.4000 ns 0.4000 ns
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