The IS42SM32160C-7BLI is a 512Mb Mobile Synchronous DRAM from Quarktwin Technology Ltd., configured as a quad 4M x 32 DRAM. It operates at a power supply of 3.3V and supports a clock frequency of 143 MHz with a CAS latency of 3, achieving a cycle time of 7.0 ns. The device features programmable CAS latency options of 2 and 3, as well as programmable burst lengths of 1, 2, 4, 8, and full page. It includes advanced functionalities such as auto refresh, temperature compensated self-refresh, and partial array self-refresh modes. The memory is organized into 8192 rows and 512 columns, with a refresh count of 8K every 64 ms. The package dimensions are 8x13 mm in a 90-ball BGA format. The operating temperature range for this part is industrial, from -40¬8C to +85¬8C, making it suitable for a variety of applications that require reliable performance in challenging environments.
IC DRAM 512MBIT PAR 60TFBGA Product overview: IS42SM32160C-7BLI from Integrated Silicon Solution, Inc. (ISSI) is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include key electrical ratings, package details, and application requirements. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-IS42SM32160C-7BL
SDRAM - Mobile Memory IC 512Mb (16M x 32) Parallel 133MHz 5.4ns 60-TFBGA (6.4x10.1)
Manufacturer: ISSI, Integrated Silicon Solution Inc
Win Source Part Number: 921646-IS42SM32160C-
Operating Temperature Range: -40°C ~ 85°C (TA)
Features: SDRAM - Mobile Memory IC 512Mb (16M x 32) Parallel 133 MHz 5.4 ns 60-TFBGA (6.4x10.1)
Package: Tray
Package: 60-TFBGA
Mounting: Surface Mount
Part Status: Discontinued at Digi-Key
Categories: Integrated Circuits (ICs)
Case / Package: 60-TFBGA (6.4x10.1)
ECCN: EAR99
Popularity: High
Fake Threat In the Open Market: 94 pct.
Supply and Demand Status: Balance
Quantity per package: 240
MSL Level: 3 (168 Hours)
REACH Status: REACH Unaffected
HTSUS: 8542.32.0028
IC DRAM 512MBIT PARALLEL 90WBGA
SDRAM - Mobile Memory IC 512Mbit Parallel 133 MHz 5.4 ns 60-TFBGA (6.4x10.1)
IC DRAM 512MBIT PARALLEL 90WBGA
| ERSAELECTRONICS PTE. LTD. | DigiKey | Win Source Electronics | Shenzhen Shengyu Electronics Technology Limited | Quarktwin Technology Ltd. | Lingto Electronic Limited | |
|---|---|---|---|---|---|---|
| Product Category | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips |
| Product Number | 774-IS42SM32160C-7BLI | IS42SM32160C-7BLI-ND | 921646-IS42SM32160C-7BLI | IS42SM32160C-7BLI | IS42SM32160C-7BLI | IS42SM32160C-7BLI |
| Product Name | Memory IC and Storage Component | Memory | Memory - SDRAM - IS42SM32160C-7BLI | Integrated Circuits (ICs) - Memory | Memory | Memory |
| Memory Category | Volatile; DRAM Chip | DRAM Chip | DRAM Chip | Volatile; DRAM Chip | DRAM; DRAM Chip | DRAM; DRAM Chip |
| Access Time | 5.4 ns | 5.4 ns | 5.4 ns | 5.4 ns | ||
| Operating Temperature | -40 to 85 C (-40 to 185 F) | -40 to 85 C (-40 to 185 F) | -40 to 85 C (-40 to 185 F) | -40 to 85 C (-40 to 185 F) | -40 to 85 C (-40 to 185 F) | |
| Package Type | BGA; Tray | 90-LFBGA | BGA; 60-TFBGA (6.4x10.1) | BGA | BGA; 60-TFBGA |
