Integrated Silicon Solution, Inc. Memory IS42RM32160C-75BL-TR

Description
SDRAM - Mobile Memory IC 512Mb (16M x 32) Parallel 133MHz 5.4ns 90-WBGA (8x13)
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Description
SDRAM - Mobile Memory IC 512Mb (16M x 32) Parallel 133MHz 5.4ns 90-WBGA (8x13)
Request a Quote
Datasheet
Datasheet Summary
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The IS42RM32160C-75BL-TR is a 512Mb Mobile Synchronous DRAM from Quarktwin Technology Ltd., configured as a quad 4M x 32 DRAM. It operates at a power supply of 2.5V and features a clock frequency of 133 MHz with a CAS latency of 3, achieving an access time of 5.4 ns. The device supports programmable CAS latency options of 2 and 3, as well as programmable burst lengths of 1, 2, 4, 8, and full page, allowing for flexible data transfer configurations. This memory chip includes advanced features such as auto refresh, temperature compensated self-refresh (TCSR), and partial array self-refresh (PASR) modes, which enhance power efficiency. It is packaged in a 90-ball BGA format (8x13 mm) and is suitable for both commercial (0¬8C to +70¬8C) and industrial (-40¬8C to +85¬8C) temperature ranges. The IS42RM32160C-75BL-TR is designed for applications requiring high-speed data transfer and efficient power management, making it a viable option for engineers looking for reliable mobile memory solutions.

Datasheet Summary
Powered by GS/AI

The IS42RM32160C-75BL-TR is a 512Mb Mobile Synchronous DRAM from Quarktwin Technology Ltd., configured as a quad 4M x 32 DRAM. It operates at a power supply of 2.5V and features a clock frequency of 133 MHz with a CAS latency of 3, achieving an access time of 5.4 ns. The device supports programmable CAS latency options of 2 and 3, as well as programmable burst lengths of 1, 2, 4, 8, and full page, allowing for flexible data transfer configurations. This memory chip includes advanced features such as auto refresh, temperature compensated self-refresh (TCSR), and partial array self-refresh (PASR) modes, which enhance power efficiency. It is packaged in a 90-ball BGA format (8x13 mm) and is suitable for both commercial (0¬8C to +70¬8C) and industrial (-40¬8C to +85¬8C) temperature ranges. The IS42RM32160C-75BL-TR is designed for applications requiring high-speed data transfer and efficient power management, making it a viable option for engineers looking for reliable mobile memory solutions.

Suppliers

Company
Product
Description
Supplier Links
Memory - IS42RM32160C-75BL-TR-ND - DigiKey
Thief River Falls, MN, United States
SDRAM - Mobile Memory IC 512Mb (16M x 32) Parallel 133MHz 5.4ns 90-WBGA (8x13)

SDRAM - Mobile Memory IC 512Mb (16M x 32) Parallel 133MHz 5.4ns 90-WBGA (8x13)

Buy Now Datasheet
Integrated Circuits (ICs) - Memory - IS42RM32160C-75BL-TR - Shenzhen Shengyu Electronics Technology Limited
Futian, China
Integrated Circuits (ICs) - Memory
IS42RM32160C-75BL-TR
Integrated Circuits (ICs) - Memory IS42RM32160C-75BL-TR
IC DRAM 512MBIT PARALLEL 90WBGA

IC DRAM 512MBIT PARALLEL 90WBGA

Supplier's Site
Memory - IS42RM32160C-75BL-TR - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
SDRAM - Mobile Memory IC 512Mbit Parallel 133 MHz 5.4 ns 90-WBGA (8x13)

SDRAM - Mobile Memory IC 512Mbit Parallel 133 MHz 5.4 ns 90-WBGA (8x13)

Buy Now Datasheet
IC DRAM 512MBIT PARALLEL 90WBGA

IC DRAM 512MBIT PARALLEL 90WBGA

Supplier's Site Datasheet

Technical Specifications

  DigiKey Shenzhen Shengyu Electronics Technology Limited Quarktwin Technology Ltd. Lingto Electronic Limited
Product Category Memory Chips Memory Chips Memory Chips Memory Chips
Product Number IS42RM32160C-75BL-TR-ND IS42RM32160C-75BL-TR IS42RM32160C-75BL-TR IS42RM32160C-75BL-TR
Product Name Memory Integrated Circuits (ICs) - Memory Memory Memory
Memory Category DRAM Chip Volatile; DRAM Chip DRAM; DRAM Chip DRAM; DRAM Chip
Operating Temperature 0 to 70 C (32 to 158 F) 0 to 70 C (32 to 158 F) 0 to 70 C (32 to 158 F)
Density 512000 kbits 512000 kbits 512000 kbits 512000 kbits
Package Type 90-LFBGA BGA BGA; 90-LFBGA
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