Integrated Silicon Solution, Inc. IT infrastructure Memory IS25WP512M-RHLA3

Description
Category: IT infrastructure Memory Win Source Part Number: 1454260-IS25WP512M-R HLA3 Manufacturer: ISSI, Integrated Silicon Solution Inc
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Description
Category: IT infrastructure Memory Win Source Part Number: 1454260-IS25WP512M-R HLA3 Manufacturer: ISSI, Integrated Silicon Solution Inc
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
IT infrastructure Memory - 1454260-IS25WP512M-RHLA3 - Win Source Electronics
Laguna Hills, CA, United States
IT infrastructure Memory
1454260-IS25WP512M-RHLA3
IT infrastructure Memory 1454260-IS25WP512M-RHLA3
Category: IT infrastructure Memory Win Source Part Number: 1454260-IS25WP512M-R HLA3 Manufacturer: ISSI, Integrated Silicon Solution Inc

Category: IT infrastructure Memory
Win Source Part Number: 1454260-IS25WP512M-RHLA3
Manufacturer: ISSI, Integrated Silicon Solution Inc

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Memory - 706-IS25WP512M-RHLA3-ND - DigiKey
Thief River Falls, MN, United States
IC FLSH 512MBIT SPI/QUAD 24TFBGA

IC FLSH 512MBIT SPI/QUAD 24TFBGA

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Futian, China
Integrated Circuits (ICs) - Memory - Memory
IS25WP512M-RHLA3
Integrated Circuits (ICs) - Memory - Memory IS25WP512M-RHLA3
512Mb QPI/QSPI, 24-ball TFBGA 6x

512Mb QPI/QSPI, 24-ball TFBGA 6x

Supplier's Site
Memory - IS25WP512M-RHLA3 - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
FLASH - NOR (SLC) Memory IC 512Mbit SPI - Quad I/O, QPI, DTR 112 MHz 7.5 ns 24-TFBGA (6x8)

FLASH - NOR (SLC) Memory IC 512Mbit SPI - Quad I/O, QPI, DTR 112 MHz 7.5 ns 24-TFBGA (6x8)

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Technical Specifications

  Win Source Electronics DigiKey Shenzhen Shengyu Electronics Technology Limited Quarktwin Technology Ltd.
Product Category Memory Chips Memory Chips Memory Chips Memory Chips
Product Number 1454260-IS25WP512M-RHLA3 706-IS25WP512M-RHLA3-ND IS25WP512M-RHLA3 IS25WP512M-RHLA3
Product Name IT infrastructure Memory Memory Integrated Circuits (ICs) - Memory - Memory Memory
Memory Category Flash Flash Flash; Non-Volatile Flash; FLASH
Operating Temperature -40 to 125 C (-40 to 257 F) -40 to 125 C (-40 to 257 F)
Density 512000 kbits 512000 kbits 512000 kbits
Package Type 24-TBGA BGA; 24-TBGA
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