Integrated Device Technology FIFOs Memory QS72211-25JR

Description
FIFO
  • FIFOs Memory - QS72211-25JR - Quarktwin Technology Ltd.
    Quarktwin Technology Ltd.
  • Integrated Circuits (ICs) - Logic - FIFOs Memory - QS72211-25JR - Acme Chip Technology Co., Limited
    Acme Chip Technology Co., Limited
Datasheet
Description
FIFO
Datasheet

Suppliers

Company
Product
Description
Supplier Links
FIFOs Memory - QS72211-25JR - Quarktwin Technology Ltd.
Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
FIFOs Memory
QS72211-25JR
FIFOs Memory QS72211-25JR
FIFO

FIFO

Buy Now Datasheet
Integrated Circuits (ICs) - Logic - FIFOs Memory - QS72211-25JR - Acme Chip Technology Co., Limited
Acme Chip Technology Co., Limited
Shenzhen, China
Integrated Circuits (ICs) - Logic - FIFOs Memory
QS72211-25JR
Integrated Circuits (ICs) - Logic - FIFOs Memory QS72211-25JR
IC FIFO SYNC 512X9 15NS

IC FIFO SYNC 512X9 15NS

Supplier's Site

Technical Specifications

  Quarktwin Technology Ltd. Acme Chip Technology Co., Limited
Product Category Memory Chips Memory Chips
Product Number QS72211-25JR QS72211-25JR
Product Name FIFOs Memory Integrated Circuits (ICs) - Logic - FIFOs Memory
Unlock Full Specs
to access all available technical data

Similar Products

SDRAM - 2420769 - RS Components, Ltd.
RS Components, Ltd.
SDRAM
2420769
Specs
Memory Category DRAM Chip
Access Time 20 ns
Number of Words 128000 k
View Details
Memory - 27C512-70WMB - Lingto Electronic Limited
Rochester Electronics
Memory
27C512-70WMB
Specs
Memory Category EPROM; EPROM
Access Time 70 ns
Density 512 kbits
View Details
Memory - Controllers - BQ2201SN-NG4 - Lingto Electronic Limited
Texas Instruments
Memory - Controllers
BQ2201SN-NG4
Specs
Operating Temperature -40 to 85 C (-40 to 185 F)
Package Type SOIC; 8-SOIC
View Details
2 suppliers
Memory - AS4SD2M32 - Micross Components, Inc.
Micross Components, Inc.
Memory
AS4SD2M32
Specs
Memory Category SDRAM; DRAM Chip
Operating Temperature -55 to 125 C (-67 to 257 F)
Density 16000 kbits
View Details