Integrated Device Technology 3.3V 256K x 36 Synchronous 3.3V I/O PipeLined SRAM 71V67603S133BGGI

Description
The 71V67603 3.3V CMOS SRAM is organized as 256K x 36. The 71V67603 SRAM contains write, data, address and control registers. The burst mode feature offers the highest level of performance to the system designer, as it can provide four cycles of data for a single address presented to the SRAM .The order of these three addresses are defined by the internal burst counter and the LBO input pin.
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Description
The 71V67603 3.3V CMOS SRAM is organized as 256K x 36. The 71V67603 SRAM contains write, data, address and control registers. The burst mode feature offers the highest level of performance to the system designer, as it can provide four cycles of data for a single address presented to the SRAM .The order of these three addresses are defined by the internal burst counter and the LBO input pin.
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Suppliers

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Product
Description
Supplier Links
3.3V 256K x 36 Synchronous 3.3V I/O PipeLined SRAM - 71V67603S133BGGI - Integrated Device Technology
San Jose, CA, USA
3.3V 256K x 36 Synchronous 3.3V I/O PipeLined SRAM
71V67603S133BGGI
3.3V 256K x 36 Synchronous 3.3V I/O PipeLined SRAM 71V67603S133BGGI
The 71V67603 3.3V CMOS SRAM is organized as 256K x 36. The 71V67603 SRAM contains write, data, address and control registers. The burst mode feature offers the highest level of performance to the system designer, as it can provide four cycles of data for a single address presented to the SRAM .The order of these three addresses are defined by the internal burst counter and the LBO input pin.

The 71V67603 3.3V CMOS SRAM is organized as 256K x 36. The 71V67603 SRAM contains write, data, address and control registers. The burst mode feature offers the highest level of performance to the system designer, as it can provide four cycles of data for a single address presented to the SRAM .The order of these three addresses are defined by the internal burst counter and the LBO input pin.

Supplier's Site Datasheet
 - 71V67603S133BGGI - Rochester Electronics
Newburyport, MA, United States
256K X 36 3.3V Synchronous SRAM 3.3V I/O, Burst Counter Pipelined Outputs, Single Cycle Deselect

256K X 36 3.3V Synchronous SRAM 3.3V I/O, Burst Counter Pipelined Outputs, Single Cycle Deselect

Supplier's Site Datasheet
Memory - 71V67603S133BGGI - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
SRAM - Synchronous, SDR Memory IC 9Mbit Parallel 133 MHz 4.2 ns 119-PBGA (14x22)

SRAM - Synchronous, SDR Memory IC 9Mbit Parallel 133 MHz 4.2 ns 119-PBGA (14x22)

Buy Now Datasheet
Integrated Circuits (ICs) - Memory - 71V67603S133BGGI - Shenzhen Shengyu Electronics Technology Limited
Futian, China
Integrated Circuits (ICs) - Memory
71V67603S133BGGI
Integrated Circuits (ICs) - Memory 71V67603S133BGGI
IC SRAM 9MBIT PARALLEL 119PBGA

IC SRAM 9MBIT PARALLEL 119PBGA

Supplier's Site

Technical Specifications

  Integrated Device Technology Rochester Electronics Quarktwin Technology Ltd. Shenzhen Shengyu Electronics Technology Limited
Product Category Memory Chips Memory Chips Memory Chips Memory Chips
Product Number 71V67603S133BGGI 71V67603S133BGGI 71V67603S133BGGI 71V67603S133BGGI
Product Name 3.3V 256K x 36 Synchronous 3.3V I/O PipeLined SRAM Memory Integrated Circuits (ICs) - Memory
Memory Category SRAM Chip SRAM Chip SRAM; SRAM Chip Volatile; SRAM Chip
Data Rate 133 MHz 133 MHz
Operating Temperature -40 to 85 C (-40 to 185 F) -40 to 85 C (-40 to 185 F) -40 to 85 C (-40 to 185 F)
Density 256 kbits 9000 kbits 9000 kbits
Number of Words 256 k
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