Insignis Technology Corporation Integrated Circuits (ICs) - Memory - Memory NDL56PFJ-8KIT

Description
DDR3L 512MB X16 FBGA 8X13(X1.0)
Description
DDR3L 512MB X16 FBGA 8X13(X1.0)

Suppliers

Company
Product
Description
Supplier Links
Shenzhen, China
Integrated Circuits (ICs) - Memory - Memory
NDL56PFJ-8KIT
Integrated Circuits (ICs) - Memory - Memory NDL56PFJ-8KIT
DDR3L 512MB X16 FBGA 8X13(X1.0)

DDR3L 512MB X16 FBGA 8X13(X1.0)

Supplier's Site
Memory - NDL56PFJ-8KIT - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
SDRAM - DDR3L Memory IC 512Mbit Parallel 800 MHz 20 ns 96-FBGA (8x13)

SDRAM - DDR3L Memory IC 512Mbit Parallel 800 MHz 20 ns 96-FBGA (8x13)

Buy Now

Technical Specifications

  Acme Chip Technology Co., Limited Quarktwin Technology Ltd.
Product Category Memory Chips Memory Chips
Product Number NDL56PFJ-8KIT NDL56PFJ-8KIT
Product Name Integrated Circuits (ICs) - Memory - Memory Memory
Memory Category Volatile; DRAM Chip DRAM; DRAM Chip
Cycle Time 20 ns
Density 512000 kbits 512000 kbits
Package Type 800 MHz BGA; 96-VFBGA
Unlock Full Specs
to access all available technical data

Similar Products

CD40105B-MIL CMOS 4-Bit-by-16-Word FIFO Register - CD40105BF - Texas Instruments
Specs
Memory Category FIFO
Package Type CDIP,DIESALE
View Details
3 suppliers
Memory - 593153-001-69 - Lingto Electronic Limited
Infineon Technologies AG
View Details
2 suppliers
Memory - AS5C1005 - Micross Components, Inc.
Micross Components, Inc.
Specs
Memory Category SRAM; SRAM Chip
Access Time 15 to 45 ns
Operating Temperature -55 to 125 C (-67 to 257 F)
View Details