Insignis Technology Corporation Memory NDL26PFI-9MET TR

Description
DDR3L 2GB X16 FBGA 7.5X13(X1.0)
Datasheet
Description
DDR3L 2GB X16 FBGA 7.5X13(X1.0)
Datasheet

Suppliers

Company
Product
Description
Supplier Links
DDR3L 2GB X16 FBGA 7.5X13(X1.0)

DDR3L 2GB X16 FBGA 7.5X13(X1.0)

Supplier's Site
Memory - NDL26PFI-9MET TR - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
SDRAM - DDR3L Memory IC 2Gbit Parallel 933 MHz 20 ns 96-FBGA (7.5x13)

SDRAM - DDR3L Memory IC 2Gbit Parallel 933 MHz 20 ns 96-FBGA (7.5x13)

Buy Now Datasheet
Futian, China
Integrated Circuits (ICs) - Memory - Memory
NDL26PFI-9MET TR
Integrated Circuits (ICs) - Memory - Memory NDL26PFI-9MET TR
IC DRAM 2GBIT PAR 96FBGA

IC DRAM 2GBIT PAR 96FBGA

Supplier's Site

Technical Specifications

  Lingto Electronic Limited Quarktwin Technology Ltd. Shenzhen Shengyu Electronics Technology Limited
Product Category Memory Chips Memory Chips Memory Chips
Product Number NDL26PFI-9MET TR NDL26PFI-9MET TR NDL26PFI-9MET TR
Product Name Memory Memory Integrated Circuits (ICs) - Memory - Memory
Memory Category DRAM; DRAM Chip DRAM; DRAM Chip Volatile; DRAM Chip
Access Time 20 ns 20 ns
Density 2000000 kbits 2000000 kbits 2000000 kbits
Operating Temperature 0 to 95 C (32 to 203 F)
Unlock Full Specs
to access all available technical data

Similar Products

Flash Memory - 1712194 - RS Components, Ltd.
RS Components, Ltd.
Specs
Memory Category Flash
Number of Words 512 k
Package Type SOIC
View Details
Memory - 0418A4ACLAA-4H - Lingto Electronic Limited
Rochester Electronics
Specs
Memory Category SRAM; SRAM Chip
Access Time 4.5 ns
Density 4000 kbits
View Details
Memory - 00002331896 - Quarktwin Technology Ltd.
Infineon Technologies AG
View Details
Memory - AS5SS256K18 - Micross Components, Inc.
Micross Components, Inc.
Specs
Memory Category SSRAM; SRAM Chip
Operating Temperature -55 to 125 C (-67 to 257 F)
Density 2048 kbits
View Details