E-LIT – Automated testing solution system allows non-contact failure inspection of semiconductor material during the manufacturing process. Inhomogeneous temperature distribution, local power loss can be measured with Lock-in Thermography. This is achieved by using the shortest measurement times combined with a high-performance thermographic camera and a specialized lock-in procedure.
The power supply for this process is clocked with a synchronization module and failures that produce mK or even μK differences are reliably detected.
Smallest defects like point and line shunts, oxide failures, transistor and diode failures on a PCB surface and in IC´s can be detected and displayed in x and y positions. Additionally, it is possible to analyze stacked-die packages or multi-chip modules in z-direction with merely changing the lock-in frequency.
Benefits of the Modular Test Bench
Online lock-in measurement with the highest sensitivity
Complete and detailed microscopy analysis
Geometrical resolution up to 1.3 μm per pixel with microscope lenses
Thermal resolution in the microkelvin range
Multi-layer analysis
Automatic scanning of larger samples due to precision mechanics
E-LIT – Automated testing solution system allows non-contact failure inspection of semiconductor material during the manufacturing process. Inhomogeneous temperature distribution, local power loss can be measured with Lock-in Thermography. This is achieved by using the shortest measurement times combined with a high-performance thermographic camera and a specialized lock-in procedure.
The power supply for this process is clocked with a synchronization module and failures that produce mK or even μK differences are reliably detected.
Smallest defects like point and line shunts, oxide failures, transistor and diode failures on a PCB surface and in IC´s can be detected and displayed in x and y positions. Additionally, it is possible to analyze stacked-die packages or multi-chip modules in z-direction with merely changing the lock-in frequency.
Benefits of the Modular Test Bench
- Online lock-in measurement with the highest sensitivity
- Complete and detailed microscopy analysis
- Geometrical resolution up to 1.3 μm per pixel with microscope lenses
- Thermal resolution in the microkelvin range
- Multi-layer analysis
- Automatic scanning of larger samples due to precision mechanics
