TDM22544D co-packages two smart power stages, two power inductors, and decoupling capacitors to implement two independent synchronous buck converters into a small 10x9x8 mm package. The package is optimized for PCB layout, heat transfer, driver/MOSFET control timing, and minimal switch node ringing.
TDM22544D OptiMOS™ dual-phase power module 140 A is available on demand only. For complete data sheets, additional information and evaluation boards please contact us here.
Summary of Features
Integrated 5.3uF input capacitors
Integrated decoupling capacitors
Integrated bootstrap capacitors
70 A per stage thermally managed
160 A per phase peak
4.25 V to 16 V input voltage
Current sensing and reporting at 5 uA/A
8 mV / C temperature analog output
0.225 V to 3 V output voltage range
Operation up to 2 MHz
Cycle-by-cycle OCP & flag
Benefits
High power density solution (>1 A/mm2)
Best-in-class TCO
Ease of use
Improves thermal management
Improves system efficiency
Improves signal integrity
Enables reduction in PDN losses
Potential Applications
Artificial intelleigence accelerator chips
CPU power
FPGA power
Telecom
Datacenter
TDM22544D co-packages two smart power stages, two power inductors, and decoupling capacitors to implement two independent synchronous buck converters into a small 10x9x8 mm package. The package is optimized for PCB layout, heat transfer, driver/MOSFET control timing, and minimal switch node ringing.
TDM22544D OptiMOS™ dual-phase power module 140 A is available on demand only. For complete data sheets, additional information and evaluation boards please contact us here.
Summary of Features
- Integrated 5.3uF input capacitors
- Integrated decoupling capacitors
- Integrated bootstrap capacitors
- 70 A per stage thermally managed
- 160 A per phase peak
- 4.25 V to 16 V input voltage
- Current sensing and reporting at 5 uA/A
- 8 mV / C temperature analog output
- 0.225 V to 3 V output voltage range
- Operation up to 2 MHz
- Cycle-by-cycle OCP & flag
Benefits
- High power density solution (>1 A/mm2)
- Best-in-class TCO
- Ease of use
- Improves thermal management
- Improves system efficiency
- Improves signal integrity
- Enables reduction in PDN losses
Potential Applications
- Artificial intelleigence accelerator chips
- CPU power
- FPGA power
- Telecom
- Datacenter