Infineon Technologies AG Memory S80KS5122GABHV020

Description
PSRAM (Pseudo SRAM) Memory IC 512Mb (64M x 8) HyperBus 200MHz 35ns 24-FBGA (6x8)
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Description
PSRAM (Pseudo SRAM) Memory IC 512Mb (64M x 8) HyperBus 200MHz 35ns 24-FBGA (6x8)
Request a Quote
Datasheet
Datasheet Summary
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The S80KS5122GABHV020 is a 512 Mb HYPERRAM,Ñ¢ self-refresh dynamic RAM (DRAM) featuring a HYPERBUS,Ñ¢ interface, designed to operate at a voltage of 1.8 V. It supports a maximum clock rate of 200 MHz and utilizes DDR technology, allowing for data transfers on both edges of the clock, achieving a data throughput of up to 400 MBps (3,200 Mbps). The memory device includes a configurable burst length capability, supporting linear and wrapped burst modes of various lengths. This DRAM offers multiple power modes, including hybrid sleep and deep power down, with a maximum current consumption of 40 mA during burst operations and a standby current of 3.1 mA at 105 ¬8C. The device is packaged in a 24-ball FBGA and is available in several temperature grades, including industrial and automotive grades, with operating ranges from -40 ¬8C to +125 ¬8C. The technology is based on a 25-nm process, making it suitable for a variety of applications requiring efficient memory solutions.

Datasheet Summary
Powered by GS/AI

The S80KS5122GABHV020 is a 512 Mb HYPERRAM,Ñ¢ self-refresh dynamic RAM (DRAM) featuring a HYPERBUS,Ñ¢ interface, designed to operate at a voltage of 1.8 V. It supports a maximum clock rate of 200 MHz and utilizes DDR technology, allowing for data transfers on both edges of the clock, achieving a data throughput of up to 400 MBps (3,200 Mbps). The memory device includes a configurable burst length capability, supporting linear and wrapped burst modes of various lengths. This DRAM offers multiple power modes, including hybrid sleep and deep power down, with a maximum current consumption of 40 mA during burst operations and a standby current of 3.1 mA at 105 ¬8C. The device is packaged in a 24-ball FBGA and is available in several temperature grades, including industrial and automotive grades, with operating ranges from -40 ¬8C to +125 ¬8C. The technology is based on a 25-nm process, making it suitable for a variety of applications requiring efficient memory solutions.

Suppliers

Company
Product
Description
Supplier Links
Memory - 448-S80KS5122GABHV020-ND - DigiKey
Thief River Falls, MN, United States
PSRAM (Pseudo SRAM) Memory IC 512Mb (64M x 8) HyperBus 200MHz 35ns 24-FBGA (6x8)

PSRAM (Pseudo SRAM) Memory IC 512Mb (64M x 8) HyperBus 200MHz 35ns 24-FBGA (6x8)

Buy Now Datasheet
 - S80KS5122GABHV020 - Rochester Electronics
Newburyport, MA, United States
S80KS5122 - 512 Mb HYPERRAM self-refresh dynamic RAM (DRAM) with HYPERBUS interface

S80KS5122 - 512 Mb HYPERRAM self-refresh dynamic RAM (DRAM) with HYPERBUS interface

Supplier's Site Datasheet
HYPERRAM

HYPERRAM

Supplier's Site Datasheet
Memory - S80KS5122GABHV020 - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
PSRAM (Pseudo SRAM) Memory IC 512Mbit HyperBus 200 MHz 35 ns 24-FBGA (6x8)

PSRAM (Pseudo SRAM) Memory IC 512Mbit HyperBus 200 MHz 35 ns 24-FBGA (6x8)

Buy Now Datasheet
Dram, 512Mbit, -40 To 105Deg C Rohs Compliant Cypress Infineon Technologies - 29AK8417 - Newark, An Avnet Company
Chicago, IL, United States
Dram, 512Mbit, -40 To 105Deg C Rohs Compliant Cypress Infineon Technologies
29AK8417
Dram, 512Mbit, -40 To 105Deg C Rohs Compliant Cypress Infineon Technologies 29AK8417
DRAM, 512MBIT, -40 TO 105DEG C ROHS COMPLIANT: YES

DRAM, 512MBIT, -40 TO 105DEG C ROHS COMPLIANT: YES

Supplier's Site

Technical Specifications

  DigiKey Rochester Electronics Lingto Electronic Limited Quarktwin Technology Ltd. Newark, An Avnet Company
Product Category Memory Chips Memory Chips Memory Chips Memory Chips Memory Chips
Product Number 448-S80KS5122GABHV020-ND S80KS5122GABHV020 S80KS5122GABHV020 S80KS5122GABHV020 29AK8417
Product Name Memory Memory Memory Dram, 512Mbit, -40 To 105Deg C Rohs Compliant Cypress Infineon Technologies
Memory Category PSRAM DRAM Chip PSRAM; SRAM Chip PSRAM; SRAM Chip DRAM Chip
Operating Temperature -40 to 105 C (-40 to 221 F) -40 to 105 C (-40 to 221 F)
Density 512000 kbits 512000 kbits 512000 kbits
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