Infineon Technologies AG Sensor technology - MEMS microphones - MEMS microphones for consumer - IM70A135 IM70A135

Description
Infineon’s XENSIV™ MEMS analog microphone IM70A135 is a compact high-performance microphone with a very high acoustic overload point of 135 dBSPL and a size of only 3.50 x 2.65 x 1.00 mm3. This microphone is based on Infineon’s new Sealed Dual Membrane MEMS technology which delivers high ingress protection (IP57) at a microphone level. The small size makes this microphone especially suited for TWS earbud applications. Summary of Features Very High 70dB(A) Signal-to-noise ratio Ultra-low power modes for battery critical applications (170/70µA) Sealed Dual Membrane (SDM) technology with IP57 ingress protection at microphone level Ultra-high acoustic overload point (AOP) of 135dBSPL Very tight part-to-part phase and sensitivity matching (± 1dB) Flat frequency response with a low LFRO (low frequency roll-off) of 37Hz Benefits Powerful far-field and low volume audio pick-up Crystal clear audio signals even in compact package size Enablement of advanced audio features (ANC, transparent hearing, audio zoom, beamforming) Potential Applications True wireless earbuds Active Noise Cancelling headphones Smart speakers Home automation and IoT devices Cameras Conference systems Applications Automotive body control module (BCM) Bringing a whole new lifestyle and health experience to today’s connected citizen Information & communication technologies
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Suppliers

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Product
Description
Supplier Links
Sensor technology - MEMS microphones - MEMS microphones for consumer - IM70A135 - IM70A135 - Infineon Technologies AG
Neubiberg, Germany
Sensor technology - MEMS microphones - MEMS microphones for consumer - IM70A135
IM70A135
Sensor technology - MEMS microphones - MEMS microphones for consumer - IM70A135 IM70A135
Infineon’s XENSIV™ MEMS analog microphone IM70A135 is a compact high-performance microphone with a very high acoustic overload point of 135 dBSPL and a size of only 3.50 x 2.65 x 1.00 mm3. This microphone is based on Infineon’s new Sealed Dual Membrane MEMS technology which delivers high ingress protection (IP57) at a microphone level. The small size makes this microphone especially suited for TWS earbud applications. Summary of Features Very High 70dB(A) Signal-to-noise ratio Ultra-low power modes for battery critical applications (170/70µA) Sealed Dual Membrane (SDM) technology with IP57 ingress protection at microphone level Ultra-high acoustic overload point (AOP) of 135dBSPL Very tight part-to-part phase and sensitivity matching (± 1dB) Flat frequency response with a low LFRO (low frequency roll-off) of 37Hz Benefits Powerful far-field and low volume audio pick-up Crystal clear audio signals even in compact package size Enablement of advanced audio features (ANC, transparent hearing, audio zoom, beamforming) Potential Applications True wireless earbuds Active Noise Cancelling headphones Smart speakers Home automation and IoT devices Cameras Conference systems Applications Automotive body control module (BCM) Bringing a whole new lifestyle and health experience to today’s connected citizen Information & communication technologies

Infineon’s XENSIV™ MEMS analog microphone IM70A135 is a compact high-performance microphone with a very high acoustic overload point of 135 dBSPL and a size of only 3.50 x 2.65 x 1.00 mm3. This microphone is based on Infineon’s new Sealed Dual Membrane MEMS technology which delivers high ingress protection (IP57) at a microphone level. The small size makes this microphone especially suited for TWS earbud applications.


Summary of Features

  • Very High 70dB(A) Signal-to-noise ratio
  • Ultra-low power modes for battery critical applications (170/70µA)
  • Sealed Dual Membrane (SDM) technology with IP57 ingress protection at microphone level
  • Ultra-high acoustic overload point (AOP) of 135dBSPL
  • Very tight part-to-part phase and sensitivity matching (± 1dB)
  • Flat frequency response with a low LFRO (low frequency roll-off) of 37Hz

Benefits

  • Powerful far-field and low volume audio pick-up
  • Crystal clear audio signals even in compact package size
  • Enablement of advanced audio features (ANC, transparent hearing, audio zoom, beamforming)

Potential Applications

  • True wireless earbuds
  • Active Noise Cancelling headphones
  • Smart speakers
  • Home automation and IoT devices
  • Cameras
  • Conference systems

Applications

  • Automotive body control module (BCM)
  • Bringing a whole new lifestyle and health experience to today’s connected citizen
  • Information & communication technologies
Supplier's Site Datasheet

Technical Specifications

  Infineon Technologies AG
Product Category Audio Microphones
Product Number IM70A135
Product Name Sensor technology - MEMS microphones - MEMS microphones for consumer - IM70A135
SN Ratio 70 dB
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