Infineon’s XENSIV™ MEMS analog microphone IM70A135 is a compact high-performance microphone with a very high acoustic overload point of 135 dBSPL and a size of only 3.50 x 2.65 x 1.00 mm3. This microphone is based on Infineon’s new Sealed Dual Membrane MEMS technology which delivers high ingress protection (IP57) at a microphone level. The small size makes this microphone especially suited for TWS earbud applications.
Summary of Features
Very High 70dB(A) Signal-to-noise ratio
Ultra-low power modes for battery critical applications (170/70µA)
Sealed Dual Membrane (SDM) technology with IP57 ingress protection at microphone level
Ultra-high acoustic overload point (AOP) of 135dBSPL
Very tight part-to-part phase and sensitivity matching (± 1dB)
Flat frequency response with a low LFRO (low frequency roll-off) of 37Hz
Benefits
Powerful far-field and low volume audio pick-up
Crystal clear audio signals even in compact package size
Enablement of advanced audio features (ANC, transparent hearing, audio zoom, beamforming)
Potential Applications
True wireless earbuds
Active Noise Cancelling headphones
Smart speakers
Home automation and IoT devices
Cameras
Conference systems
Applications
Automotive body control module (BCM)
Bringing a whole new lifestyle and health experience to today’s connected citizen
Information & communication technologies
Infineon’s XENSIV™ MEMS analog microphone IM70A135 is a compact high-performance microphone with a very high acoustic overload point of 135 dBSPL and a size of only 3.50 x 2.65 x 1.00 mm3. This microphone is based on Infineon’s new Sealed Dual Membrane MEMS technology which delivers high ingress protection (IP57) at a microphone level. The small size makes this microphone especially suited for TWS earbud applications.
Summary of Features
- Very High 70dB(A) Signal-to-noise ratio
- Ultra-low power modes for battery critical applications (170/70µA)
- Sealed Dual Membrane (SDM) technology with IP57 ingress protection at microphone level
- Ultra-high acoustic overload point (AOP) of 135dBSPL
- Very tight part-to-part phase and sensitivity matching (± 1dB)
- Flat frequency response with a low LFRO (low frequency roll-off) of 37Hz
Benefits
- Powerful far-field and low volume audio pick-up
- Crystal clear audio signals even in compact package size
- Enablement of advanced audio features (ANC, transparent hearing, audio zoom, beamforming)
Potential Applications
- True wireless earbuds
- Active Noise Cancelling headphones
- Smart speakers
- Home automation and IoT devices
- Cameras
- Conference systems
Applications
- Automotive body control module (BCM)
- Bringing a whole new lifestyle and health experience to today’s connected citizen
- Information & communication technologies