Infineon Technologies introduces Double DPAK (D-DPAK), the first top-side cooled surface mount device (SMD) package addressing high power SMPS applications such as PC power, solar, server and telecom.
The benefits of the already existing high voltage technology CoolSiC™ Schottky diode 650 V G6 is combined with the innovative concept of top-side cooling, providing a system solution for high current hard switching topologies such as PFC and a high-end efficiency solution for LLC topologies.
Summary of Features
Offers best-in-class VF and FOM Qc x VF
Improved dv/dt ruggedness
Easy and effective match with CoolMOS™ 7 SJ MOSFET families
Thermal decoupling of board and semiconductor allows to overcome thermal PCB limits
Reduced parasitic source inductance improves e iciency and ease-of-use
Enables higher power density solutions
Exceeding the highest quality standards
Benefits
Enabling highest energy efficiency
Thermal decoupling of board and semiconductor allows to overcome thermal PCB limits
Reduced parasitic source inductance improves e iciency and ease-of-use
Enables higher power density solutions
Exceeding the highest quality standards
Potential Applications
Telecom
Server
Solar
PC power
SMPS
Applications
48 V intermediate bus converter (IBC)
Complete system solutions for smart TVs
DIN rail power supplies
Infineon Technologies introduces Double DPAK (D-DPAK), the first top-side cooled surface mount device (SMD) package addressing high power SMPS applications such as PC power, solar, server and telecom.
The benefits of the already existing high voltage technology CoolSiC™ Schottky diode 650 V G6 is combined with the innovative concept of top-side cooling, providing a system solution for high current hard switching topologies such as PFC and a high-end efficiency solution for LLC topologies.
Summary of Features
- Offers best-in-class VF and FOM Qc x VF
- Improved dv/dt ruggedness
- Easy and effective match with CoolMOS™ 7 SJ MOSFET families
- Thermal decoupling of board and semiconductor allows to overcome thermal PCB limits
- Reduced parasitic source inductance improves e iciency and ease-of-use
- Enables higher power density solutions
- Exceeding the highest quality standards
Benefits
- Enabling highest energy efficiency
- Thermal decoupling of board and semiconductor allows to overcome thermal PCB limits
- Reduced parasitic source inductance improves e iciency and ease-of-use
- Enables higher power density solutions
- Exceeding the highest quality standards
Potential Applications
- Telecom
- Server
- Solar
- PC power
- SMPS
Applications
- 48 V intermediate bus converter (IBC)
- Complete system solutions for smart TVs
- DIN rail power supplies
